2021
DOI: 10.1016/j.jelechem.2021.115582
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Mechanistic study of Ni–Cr–P alloy electrodeposition and characterization of deposits

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Cited by 19 publications
(7 citation statements)
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“…Two reduction peaks at −0.70 V and −0.85 V were observed in the voltametric plot, confirming that reduction in Cr(III) ions has two steps in a simple aqueous solution. This result is consistent with that reported by Hecho et al., to explain the observed phenomena [29–31]. We also characterized the optimum electrodeposition time was by checking the Cr surface features with different applying potential time such as 100, 200, and 300 sec at −1.0 V. As seen in Figures 2(B)–(D), an electrodeposition time of 200 s is best from observing uniformity of the Cr film quality under an optical microscope.…”
Section: Figuresupporting
confidence: 90%
“…Two reduction peaks at −0.70 V and −0.85 V were observed in the voltametric plot, confirming that reduction in Cr(III) ions has two steps in a simple aqueous solution. This result is consistent with that reported by Hecho et al., to explain the observed phenomena [29–31]. We also characterized the optimum electrodeposition time was by checking the Cr surface features with different applying potential time such as 100, 200, and 300 sec at −1.0 V. As seen in Figures 2(B)–(D), an electrodeposition time of 200 s is best from observing uniformity of the Cr film quality under an optical microscope.…”
Section: Figuresupporting
confidence: 90%
“…Compared to a 0.2 Ni plating solution, a 0.2 Ni-0.1 P plating solution exhibits almost the similar feature except that the peak potential shifts slightly to the positive direction, suggesting that P is co-deposited with Ni. Similar results are also reported in some literature [28,41]. This finding is typically different from the fabrication of Ni-P by electroless plating, where the P in the Ni-P alloy is obtained by the decomposition of H 2 PO 2 À in the temperature range of…”
supporting
confidence: 88%
“…Similar results are also reported in some literature. [28,41] This finding is typically different from the fabrication of Ni-P by electroless plating, where the P in the Ni-P alloy is obtained by the decomposition of H 2 PO 2 À in the temperature range of 60-95 C. [42][43][44] Obviously, the onset potential of Ni (II) ! Ni in 0.2 Ni-0.1 P is more positive (À0.84 V vs. Ag) than that in 0.2 Ni (À0.94 V vs. Ag), suggesting that H 2 PO 2 À promotes the initiation of Ni-P alloy nucleation.…”
Section: Electrodeposition and Characterization Of Ni-p Alloysmentioning
confidence: 99%
“…Using the orthogonal experimental method to investigate the effect of plating solution composition, process parameters, etc., on coating appearance, deposition rate, surface hardness, and other indicators [17] , three plating solution components, namely, chromium chloride (CrCl 3 •6H 2 O), citric acid…”
Section: Orthogonal Experimentsmentioning
confidence: 99%