2010
DOI: 10.1007/s10853-010-4562-9
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Memory characteristics of Al2O3/LaAlO3/SiO2 multilayer structures with tunnel oxide thickness variation

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Cited by 5 publications
(4 citation statements)
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“…LaAlO 3 is a great example with almost no diffusion at conventional deposition temperatures, and the LaAlO 3 film has been successfully deposited on Si, MgO, and SrTiO 3 substrates. In addition, the LaAlO 3 film is a potential buffer layer for the growth of various perovskite films. Furthermore, because of the low conduction band offset, LaAlO 3 can be utilized as a charge storage layer in the fields of charge trap flash devices . In particular, LaAlO 3 is a powerful candidate for high- k materials in advanced Si-based complementary metal-oxide-semiconductor (CMOS) devices , because of its own unique features. , …”
Section: Introductionmentioning
confidence: 99%
“…LaAlO 3 is a great example with almost no diffusion at conventional deposition temperatures, and the LaAlO 3 film has been successfully deposited on Si, MgO, and SrTiO 3 substrates. In addition, the LaAlO 3 film is a potential buffer layer for the growth of various perovskite films. Furthermore, because of the low conduction band offset, LaAlO 3 can be utilized as a charge storage layer in the fields of charge trap flash devices . In particular, LaAlO 3 is a powerful candidate for high- k materials in advanced Si-based complementary metal-oxide-semiconductor (CMOS) devices , because of its own unique features. , …”
Section: Introductionmentioning
confidence: 99%
“…The crystallization of the film will generate grain boundaries, which can act as current leakage paths [18]. The excellent data retention characteristics of S1 should be attributed to the amorphous charge trapping layer [24] and variable potential barrier E B (0.8 to 1.6 eV), which suppress the leakage of trapped electrons toward the tunneling and blocking oxide. It is observed that S1 exhibits a faster program and erase speed than S2 and S3.…”
Section: Resultsmentioning
confidence: 99%
“…Recently, numerous technologies have been developed for the preparation of thin film or crystal embedded thin film devices [6][7][8]. Among various methods to prepare semiconductor or insulator films, atomic layer deposition (ALD), physical vapor deposition (PVD), and chemical vapor deposition (CVD) appear to be the most useful new technologies [9][10][11].…”
Section: Introductionmentioning
confidence: 99%