2018 IEEE Symposium on VLSI Technology 2018
DOI: 10.1109/vlsit.2018.8510707
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Memory Technology: The Core to Enable Future Computing Systems

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Cited by 5 publications
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“…To achieve high-density ferroelectric memories, ferroelectric HfO 2 (FE-HfO 2 ) has been paid attention because of its high CMOS compatibility, high scalability, and high coercive electrical field. [1][2][3] However, the right endurance of FE-HfO 2 -based capacitors is still limited mainly by dielectric breakdown (DB). 4,5) Time-dependent dielectric breakdown (TDDB) measurements are performed to evaluate the lifetime of FE-HfO 2 memories.…”
mentioning
confidence: 99%
“…To achieve high-density ferroelectric memories, ferroelectric HfO 2 (FE-HfO 2 ) has been paid attention because of its high CMOS compatibility, high scalability, and high coercive electrical field. [1][2][3] However, the right endurance of FE-HfO 2 -based capacitors is still limited mainly by dielectric breakdown (DB). 4,5) Time-dependent dielectric breakdown (TDDB) measurements are performed to evaluate the lifetime of FE-HfO 2 memories.…”
mentioning
confidence: 99%