MEMS-Capacitive Pressure Sensor Fabricated Using Printed-Circuit-Processing Techniques

Palasagaram, J.N.; Ramadoss, Ramesh

doi:10.1109/jsen.2006.884430

Cited by 92 publications

(52 citation statements)

References 3 publications

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“…This decreases the distance between the electrodes, thus increasing the capacitance of the sensing element. When the atmospheric pressure is decreased, the diaphragm flexes outward causing the distance between the electrode to increase, resulting in a lower capacitance on the sensing element 9 .…”

Section: Capacitive Pressure Sensorsmentioning

confidence: 99%

Survey of Sensor Technology for Aircraft Cabin Environment Sensing

Klein

Loo

Kiepert

et al. 2011

41st International Conference on Environmental Systems

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This is an author-produced, peer-reviewed version of this article. The aircraft cabin environment is unique due to the proximity of the passengers, the need for cabin pressurization, and the low humidity. All of these aspects are complicated by the fact that the aircraft is a semi-enclosed structure. There is an increased desire to monitor the aircraft cabin environment with various sensors for comfort and safety. However, the aircraft cabin environment is composed of a large number of factors. Some of these factors can include air quality, temperature, level of pressurization, and motion of the aircraft. Therefore, many types of sensors must be used to monitor aircraft environments. A variety of technology options are often available for each sensor. Consequently, a fair number of tradeoffs need to be carefully considered when designing a sensor monitoring system for the aircraft cabin environment. For instance, a system designer may need to decide if the increased accuracy of a sensor using a particular technology is worth the increased power consumption over a similar sensor employing a more efficient, less accurate technology. In order to achieve a good solution, a designer needs to understand the tradeoffs and general operation for all of the different sensor technologies that could be used in the design. The purpose of this paper is to provide a survey of the current sensor technology. The primary focus of this paper is on sensors and technologies that cover the most common aspects of aircraft cabin environment monitoring. The first half of this paper details the basic operation of different sensor technologies. The second half covers the individual environmental conditions which need to be sensed. This will include the benefits, limitations, and applications of the different technologies available for each particular type of sensor.

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Section: Capacitive Pressure Sensorsmentioning

confidence: 99%

Survey of Sensor Technology for Aircraft Cabin Environment Sensing

Klein

Loo

Kiepert

et al. 2011

41st International Conference on Environmental Systems

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“…This fabrication methodology would be promising for various applications since copper exhibits properties of low resistance, high current carrying capability and scalability which promote its ability to support high current density and viability for micro-devices [24][25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

Pimpin

Srituravanich

2017

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Abstract.This study aims to demonstrate a simple fabrication technique of freestanding electroplated metallic microstructures by modifying a substrate roughness. The proposed technique utilizes counter effects between two forces, i.e. an intrinsic force causing shrinkage in an electroplated metallic microstructure, and an adhesive force adhering a metallic microstructure to a substrate. With the modification of substrate roughness until the adhesive force becomes weaker than the induced intrinsic force, electroplated metallic microstructures would spontaneously release from the substrate after the electroplating process. Three parameters, i.e. substrate roughness, electroplated square structure's area and electroplated rectangular structure's width-to-length ratio, were experimentally studied. The results showed that the electroplated structure with a smaller size and smaller width-to-length ratio was more easily detached from the substrate for a given substrate roughness. In addition, for the same electroplated structure, a substrate with less roughness allowed a detachment of electroplated microstructure more easily.

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“…Printed circuit board (PCB) technology is such an example that is very mature because of the demands of the consumer electronics market, notably in the field of mobile communications and automotive industry. It is no wonder that this technology has also become interesting for the production of various types of sensors [1][2][3][4]. The technological possibilities of PCB production processes also allow for the fabrication of simple micro-electromechanical structures, so that PCBMEMS is today a well-established research field [5,6].…”

Section: Introductionmentioning

confidence: 99%

Thermal flow sensors based on printed circuit board technology

Sauter

Glatzl

Köhl

et al. 2014

Fifteenth International Symposium on Quality Electronic Design

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Measurement of air flows is an important task in many process monitoring systems. In applications like control of ventilation and air conditioning systems, robustness, ease of use, and cost are important issues calling for simple and effective sensor design. This paper investigates the use of commercial-off-the-shelf printed circuit board technologies for the fabrication of calorimetric flow sensors. Such sensors are known to be sensitive when being implemented using thin-film technology. The paper reviews the operation principle of thermal flow sensors and their performance in micromachined silicon technology for comparison. Subsequently, a similar design is introduced where heating and temperature sensing elements are made from standard copper traces on a flexible PCB substrate. Simulation studies demonstrate the basic viability of this approach, even if it might entail some performance penalties. First experimental data of sensor prototypes show that the repeatability of the PCB manufacturing processes is basically sufficient for using copper traces as sensors, but leaves also room for future improvement in both technology and sensor design.

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MEMS-Capacitive Pressure Sensor Fabricated Using Printed-Circuit-Processing Techniques

Cited by 92 publications

References 3 publications

Survey of Sensor Technology for Aircraft Cabin Environment Sensing

Survey of Sensor Technology for Aircraft Cabin Environment Sensing

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

Thermal flow sensors based on printed circuit board technology

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