MEMS Materials and Processes Handbook

Dubey

et al. 2019

JERR

109

This review article through light on a highly promising & demanding technology, which is set to revolutionize nearly every product category in present era, while discussing the Concept, Design & Development, Fabrication techniques and applications of micro electro-mechanical systems (MEMS) based Devices or systems. Microelectromechanical system discloses outstanding flexibility and adaptability in miniaturization devices followed by their compact dimension, low power consumption, and fine performance. The MEMS devices have numerous and very high potentials of creating a new field of applications for mobile equipment’s with increased flexibility & more reliability. This work deals with research carried out for the development of MEMS based sensors & Actuators and appropriate uses of MEMS. This work carries information’s regarding subsequent commercial and real life applications of MEMS and discusses various recent technological innovations carried out with their advantages & disadvantages. This work also describes the historical development of micro-electromechanical system (MEMS) sensor technology.

Section: History Of Memsmentioning

confidence: 99%

Section: History Of Memsmentioning

confidence: 99%

Section: Imentioning

confidence: 99%

Section: Imentioning

confidence: 99%

Section: Mems Design Processesmentioning

confidence: 99%

See 3 more Smart Citations

MEMS Technology: A Review

Dubey

et al. 2019

JERR

109

Highly Bendable Piezoelectric Resonators for Flexible Radio‐Frequency Electronics

Zhang

Gao

Jiang

et al. 2018

Adv Elect Materials

flexible organic or inorganic transistors. However, in many of the emerging applications, such as the Internet of Things and implantable electronic systems, in addition to the aforementioned basic building blocks, functional elements that include wireless RF electronic devices are also essential elements for wireless interconnection and data transmission. RF resonators, such as film bulk acoustic resonators (FBARs), which are traditionally used as the basic building blocks for modern RF filters [12] and oscillators, [13] are a natural candidate for wireless flexible electronics. FBAR-based electronic systems have also been extensively used in the biochemical sensing and actuating domains, [14] e.g., chemical vapors [15] and antibody-antigen reactions for immunosensors. [16] Although FBARs are small in size and light in weight, they have traditionally not been amenable to mechanical bending or stretching because of their rigid and brittle silicon substrate. Therefore, incorporating flexible electronic technology into FBARs is highly demanding and offers much more functionality for next-generation flexible electronic systems. However, since the fabrication process of these FBARs is intrinsically incompatible with the majority of plastic substrates, it is difficult to fabricate flexible FBARs with prominent electrical performance and mechanical flexibility. Previously, a flexible air-gap-type FBAR on a silicon substrate was demonstrated by thinning the silicon wafer to 50 µm. [17] By means of directly fabricating the resonator on polyimide, FBARs integrated on arbitrary substrates (polyimide, glass, and silicon) have also been achieved but with compromised electrical performance. [18] In our previous work, free-standing FBARs on polyethylene terephthalate substrates were demonstrated. [19] However, none of these devices is fully qualified for the rigorous requirements of satisfactory mechanical flexibility and uncompromised electrical performance.In this work, a highly bendable FBAR was introduced to meet these rigorous requirements by placing the FBAR at the mechanical neutral plane using two polyimide thin films. Furthermore, to achieve a high quality factor, the acoustic energy should be efficiently trapped in the material stack by a significant acoustic impedance difference between the FBAR and its surroundings. Therefore, air cavities were created both above

Ka‐band distributed microelectromechanical systems transmission line phase shifter using metal air metal switch

Teymoori

Dousti

Afrang

2021

Circuit Theory & Apps

A new approach for designing a two‐state unit cell for a six‐bit distributed coplanar waveguide microelectromechanical systems (MEMS) phase shifter is proposed in this study. The proposed structure includes metal air metal (MAM) capacitors as switches and consists of a unit cell with one MEMS and two MAM switches to produce two phase shifts per unit cell. In the first state, the MAM switches are pulled down and a 5.625° phase shift is achieved, and in the second state, the MEMS switch is actuated to yield a phase shift of 11.25°. The designed structure is modeled using equivalent transmission line circuit model and simulated in the Ka‐band at 34 GHz, employing advanced design system (ADS), ANSOFT HFSS and COMSOL software. Based on the modeling and simulation results, the root‐mean‐square (RMS) phase error is 1.4°, and maximum return loss and minimum insertion loss for all 64 states are better than −10.1 and −1.45 dB, respectively. The main advantages of the designed structure are its small size, low loss, low phase error and a simple phase shift mechanism. A fabrication process is also proposed for the distributed MEMS transmission line (DMTL) phase shifter that shows the feasibility of the proposed design. The proposed structure can be easily scaled to other bands and used in applications with more bits as complex as phased array antennas.