MEMS Packaging Materials

Abstract

This chapter discusses the differences between the heritage microcircuit packaging world and the still evolving MEMS packaging arena. Materials used in the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to traditional microcircuit chips, MEMS often include moving structures along with the need to have contact with the external environment, driving the requirements for packaging such components. Thus, some functions include interaction with the surrounding environment, such as pressure sensors. This imposes new requisites on packaging, since in regular microelectronics the chip must be protected completely from any impact from the environment. Packaging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstrating novel packaging/material solutions. MEMS Packages and ApplicationsPackaging for MEMs provides for power and signal paths; thermal management; mechanical support; and environmental protection and/or interface protection. MEMS pose numerous packaging challenges that often drive custom solutions by the very nature of their configurations and applications. Commercialized MEMS products such as inkjets and airbag sensors use simple packaging solutions; but devices that involve environmental interface have special requirements that drive

Design and Test of a Soft Plantar Force Measurement System for Gait Detection

“…To prepare for subsequent applications, a ceramic dual-in-line package was designed to provide the sensor chip with mechanical support, power and signal paths, environmental protection, and/or interface protection [26]. A strong epoxy adhesive was used to mount the chip into the package, and the pads were bonded to the pins correspondingly.…”

Oxygen Plasma and Humidity Dependent Surface Analysis of Silicon, Silicon Dioxide and Glass for Direct Wafer Bonding

“…Emerging nanoelectronics, micro-electromechanical systems (MEMS) and microfluidic devices [1][2][3][4][5] require the integration of different substrates such as silicon (Si), 6 silicon dioxide (SiO 2 ) 7 and glass. 8 Direct bonding of these materials onto a common substrate requires proper surface treatments [9][10][11][12][13] to maintain desirable mechanical, electrical and chemical properties.…”

Influence of Numerical Aperture on Molten Area Formation in Fusion Micro-Welding of Glass by Picosecond Pulsed Laser

“…Glass material is widely used in optics and semiconductor industries because of its excellent optical transparency, chemical durability, and heat resistance [1][2][3]. Recently, the reliable and stable joining of glass materials is required owing to the demand for glass products with small and complicated shapes [4,5]. A lot of techniques such as optical contact [6], the gluing method, and anodic bonding have been used to join glass materials together [7].…”