MEMS Using CMOS Wafer

Fang, Weileun; Li, Sheng-Shian; Chiu, Yi; Li, Ming-Huang

doi:10.1002/9783527823239.ch8

Cited by 5 publications

(4 citation statements)

References 171 publications

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“…Secondly, the sensing area and electrical routings needed for this design can be accomplished through the metal layers of the CMOS platform. However, due to the thin film residual stresses of the CMOS-platform, warpage of the released electrode may potentially occur [129,130]. To compensate this problem, supporting oxide pillar structures were used to enhance structural rigidity of the suspended electrodes [116][117][118][119], as shown in figure 18.…”

Section: Sensing Electrodementioning

confidence: 99%

“…Presently many commercial gas sensors have been demonstrated using the MEMS technologies [146,147]. By leveraging the post-CMOS micromachining processes [90,130] and further depositing sensing materials, various gas sensors with monolithically integrated sensing circuits have also been realized using the CMOS platform. For example, as shown in figure 23(a), the CMOS-MEMS GC SoC in [144] consists of the chemo-resistive gas sensing unit and various signal processing circuits such as the calibration circuit, analog to digital converter, the micro-control unit, and so on.…”

Section: Gas Sensorsmentioning

confidence: 99%

“…structures in figures 21, 23, and 25) anchored to the substrate. The major drawbacks of CMOS-MEMS structures such as the existing of un-wanted deformation by the thin film residual stresses [130] and the CTE mismatch of the metal and dielectric films [129] have minor influences on the performances of these environment sensors. Thus, the CMOS-MEMS humidity sensors have been successfully commercialized by Sensirion [181], and the commercial CMOS-MEMS IR sensors have been demonstrated by [20][21][22][23].…”

Section: Conclusion and Future Perspectivesmentioning

confidence: 99%

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CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs

Lee

Hsieh

Lin

et al. 2021

J. Micromech. Microeng.

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The booming growth in environmental conditions sensing and monitoring pushes the need of inexpensive environment sensors with small size and low power consumption. The outbreak of COVID-19 further increases the need for fast monitoring of environment conditions. The micro-electrical-mechanical-systems (MEMS) technologies are considered as promising solutions to realize the required environment sensors. The mature complementary metal-oxide-semiconductor (CMOS) process platforms available in many foundries can be extended to fabricate MEMS sensors to offer the advantage of relatively easier commercialization. Moreover, by leveraging the characteristics of CMOS process platforms, the integration of multiple sensors and sensing circuits to form a compact sensing system can also be achieved. This review paper will focus on introducing the miniaturized environmental sensing devices implemented and integrated using the CMOS-MEMS technologies. In general, the CMOS chips for environment sensing are firstly fabricated using the foundry-available CMOS processes, and then the post-CMOS micromachining processes are performed to implement the CMOS-MEMS environment sensors. This paper respectively reviews five different environment sensors (including the infrared, pressure (barometer), humidity/temperature, and gas sensors) using the CMOS-based MEMS technologies. The advantages and design concerns of sensors fabricated by different CMOS and post-CMOS processes are introduced and discussed. Moreover, the CMOS-MEMS environment sensing hub implemented through the monolithic integration of multiple environment sensors is also introduced.

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Section: Sensing Electrodementioning

confidence: 99%

Section: Gas Sensorsmentioning

confidence: 99%

Section: Conclusion and Future Perspectivesmentioning

confidence: 99%

See 1 more Smart Citation

CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs

Lee

Hsieh

Lin

et al. 2021

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Nowadays, many three-dimensional integrated circuits (3D-IC) provide a promising solution that extends beyond Moore's law by applying wafer-bonding techniques [7]. Remarkably, in the device fabrication process, such as complementary metal-oxide-semiconductor image sensors, micro-electro-mechanical-systems, light emitting diodes, memory stacking, and logic/memory stacking, the role of wafer-bonding technology cannot be diminished [3,[8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

In-situ temperature-dependent sheet resistance study of Cu films in oxygen ambient for heterogeneous integrations

Chavan,

Kim,

Choi

et al. 2024

Nanotechnology

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Controlling and preventing Cu oxidation is crucial for improving the performance and reliability of Cu-Cu bonding. Ni-B films were selectively deposited on Cu films to block the Cu oxidation. The resistivity changes of the Cu films in N2 and O2 ambient were measured by using a four-point probe in the in-situ temperature-dependent resistance measurements at the temperature from room temperature to 400°C. The resistivity changes of the 100nm-thick Cu films without Ni-B increased rapidly at a higher temperature (284°C) in the O2 ambiance. The change of resistivity-increase of 100nm-thick Cu with ~50 nm-thick Ni-B (top) film was lower than the Cu films without Ni-B films due to the blocking diffusion of O2 atoms by the Ni-B films. The resistivity-change and oxidation barrier properties were studied using SEM, FIB, TEM, EDX, and SIMS tools. The proposed article will be helpful for the upcoming advancement in Cu-Cu bonding using selected-area deposition.

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High-Sensitivity Transimpedance Amplifier for MEMS Microsensor Readout in Acetone Vapor Detection

Ramírez-Domínguez,

de Oca-Mora,

Woo-García

et al. 2023

Lecture Notes in Networks and Systems

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MEMS Using CMOS Wafer

Cited by 5 publications

References 171 publications

CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs

CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs

In-situ temperature-dependent sheet resistance study of Cu films in oxygen ambient for heterogeneous integrations

High-Sensitivity Transimpedance Amplifier for MEMS Microsensor Readout in Acetone Vapor Detection

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