“…Resistance random access memory (RRAM), owing to its long time reversibly switching between high-resistance states (HRS) and low-resistance states (LRS) under different bias voltages and scan directions, has been considered to be the most prospective candidate for future memory technologies. , Currently, in various aspects of controlling film thickness, designing nanostructures, changing external environment, and test conditions, various materials have been studied in RRAM applications, including binary metal oxides of ZnO, TiO 2 , , , NiO, Cu x O, and HfO 2 , , multiple compounds of Cu 2 ZnSnSe 4 , Cu(In 1– x Ga x )Se 2 , and Cu 2 FeSnS 4 , and also heterostructures of MoS 2 /ZnO, BiFeO 3 /Cu 2 ZnSnSe 4 , etc. Though many materials and device designs have been reported and some important conclusions have been obtained to meet the real needs of a faster reading/writing speed, higher storage density, and lower energy consumption in applications, , efforts for designing new structures or materials that possess excellent resistive switching properties are still necessary.…”