Metal-Metal Bonding Properties of Copper Oxide Nanoparticles

Maeda, Takafumi; Kobayashi, Yoshio; Yasuda, Yusuke; Morita, Toshiaki

doi:10.1380/ejssnt.2014.105

Cited by 5 publications

(2 citation statements)

References 16 publications

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“…Accordingly, this mechanism was not considered to dominate in the present work. A shear strength as high as 41.7 MPa at 3.0 M was achieved, the strongest among our works on Cu-Cu bonding [48][49][50][51][52][53][54][55][56]. This result supported the implication obtained by the SEM observation (Fig.…”

Section: Bonding Propertysupporting

confidence: 87%

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Preparation of high-concentration colloid solutions of metallic copper particles and their use in metal–metal bonding processes

et al. 2019

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A high-concentration colloid solution of metallic copper nanoparticles was prepared by the reduction of copper ions in aqueous solutions, and the nanoparticles were used to study metal-metal bonding. The colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of CuCl 2 and an aqueous solution of hydrazine (reductant) in the presence of citric acid and n-hexadecyltrimethylammonium bromide (stabilizers) at a final copper concentration as high as 0.1 M. The copper-particle size was ca. submicrometer. Many tiny particles with sizes of ca. 10-20 nm were deposited on the submicron-sized particles at high hydrazine concentrations. The tiny particles were considered to be produced through the growth of particle nuclei generated at the final reaction stage by residual hydrazine derived from the high hydrazine concentration. Metallic-copper discs were successfully bonded by annealing at 400 °C and a pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metallic-copper particles. The shear strength of the bonded copper discs was then measured. The highest shear strength of 41.7 MPa was recorded for the tiny particles/ immobilized particles, which could be explained by the low melting points of the tiny particles and the increase in bulk density provided by the dominant incorporation of the tiny particles into voids between the submicron-sized particles.

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Section: Bonding Propertysupporting

confidence: 87%

“…The methods are quite simple, safe, and do not impart a high environmental load. From this viewpoint, our research group has produced metallic copper particles produced in aqueous solution, and studied metal-metal bonding using the particles [48][49][50][51][52][53][54][55][56].…”

Section: Introductionmentioning

confidence: 99%