Metal−Organic Decomposition Ink for Printed Electronics

Choi, Yejung; Seong, Kwang‐dong; Piao, Yuanzhe

doi:10.1002/admi.201901002

Cited by 59 publications

(59 citation statements)

References 102 publications

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“…The most important component of conductive ink is conductive filler (active material), including conductive polymers, carbon nanotubes, graphene, organometallic compounds, 2 of 12 metal precursors, or metallic nanoparticles (NPs) [6][7][8][9]. Among these fillers, metallic nanoparticles are considered the most promising candidate for the preparation of conductive inks, because of their high specific surface energy and surface-to-volume ratio, which enhances their sensitivity to heat [10].…”

Section: Introductionmentioning

confidence: 99%

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Pajor-Świerzy

Szendera

Pawłowski

et al. 2021

Colloids and Interfaces

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Nanocomposite inks composed of nickel–silver core–shell and silver nanoparticles (NPs) can combine the advantages of lower cost, high conductivity, and low-temperature sintering processes, which have attracted much attention in the development of materials for printed flexible electronics. In this context, in the present paper, we report the process of preparation of nanocomposite ink containing nickel–silver core–shell nanoparticles, as the main filler, and silver nanoparticles, as doping material, and their application for the fabrication of conductive coatings. It was found that the addition of a low concentration of Ag NPs to ink formulation based mainly on low-cost Ni-Ag NPs improves the conductive properties of coatings fabricated by ink deposition on a glass substrate. Two types of prepared nanocomposite ink coatings showed promising properties for future application: (1) doped with 0.5% of Ag NPs sintered at 200 °C as low cost for larger industrial application and, (2) containing 1% of Ag NPs sintered at 150 °C for the fabrication of conductive printed patterns on flexible substrates. The conductivity of such nanocomposite films was similar, about of 6 × 106 S/m, which corresponds to 35% of that for a bulk nickel.

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Section: Introductionmentioning

confidence: 99%

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Pajor-Świerzy

Szendera

Pawłowski

et al. 2021

Colloids and Interfaces

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“…[ 85–88 ] Even though MOD inks can also be obtained from gold their higher cost and lower conductivity deem them less attractive. [ 83 ]…”

Section: Enabling Technologies For Olaementioning

confidence: 99%

A Review on Materials and Technologies for Organic Large‐Area Electronics

Buga

Viana

2021

Adv Materials Technologies

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New and innovative applications in the field of electronics are rapidly emerging. Such applications often require flexible or stretchable substrates, lightweight and transparent materials, and design freedom. This paper offers a complete overview concerning flexible electronics manufacturing, focusing on the materials and technologies that have been recently developed. This combination of materials and technologies aims to fuel a fast, economical, and environmentally sustainable transition from the conventional to the novel and highly customizable electronics. Organic conductors, semiconductors, and dielectrics have recently gathered lots of attention since they are compatible with printing technologies, and can be easily spread over large and flexible substrates. These printing technologies are usually simple and fast procedures, which rely on low‐cost and recycle‐friendly materials, intended for large‐scale fabrication. Overall, even though organic large‐area electronics manufacturing is still in its early stages of development, it is a field with tremendous potential that holds promise to revolutionize the way products are designed, developed, and processed from the factory premises to the consumers’ hands. Besides, this technology is highly versatile and can be applied to a large array of sectors such as automotive, medical, home design, industrial, agricultural, among others.

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“…The CuF–amine complex can be directly transformed to a conductive Cu film via a low-temperature thermal decomposition process, typically involving an in situ nucleation and the growth of Cu nanoparticles. Recently, several excellent reviews have discussed MOD inks [ 131 , 132 ], and readers can refer to the detail of MOD inks. However, there is still a significant problem with MOD inks.…”

Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

“…Formulation, printing, and sintering processes for both types of ink and possible problems that may arise during printing (nozzle clogging of particle ink) and sintering (substrate degeneration upon sintering at a high temperature for particle ink) are depicted in the simplified illustration. Reprinted with permission from reference [ 131 ], Copyright WILEY-VCH Verlag GmbH & Co, 2019.…”

Section: Figurementioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Metal−Organic Decomposition Ink for Printed Electronics

Cited by 59 publications

References 102 publications

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

A Review on Materials and Technologies for Organic Large‐Area Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

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