Supercritical fluid deposition (SCFD) of SiO 2 thin film using supercritical fluid CO 2 (SCF CO 2 ) was investigated. Tetraethyl orthosilicate (TEOS) and O 2 were used as precursor and reactant, respectively. Growth characteristics of SCFD SiO 2 were investigated as a function of key growth parameters including the concentration of precursors, deposition time, and temperature. The activation energy of SCFD SiO 2 was lower than the reported value of chemical vapor deposition of SiO 2 , indicating the solvation effects of SCF CO 2 on the reaction of TEOS and O 2 . By controlling precursor concentrations, excellent gap filling of SCFD SiO 2 was achieved even inside of anodic aluminum oxide with less than 50 nm hole diameter. Leakage current of SCFD SiO 2 films increased with increasing oxygen concentration, which was attributed to the decrease of the film density. Higher O 2 concentration led to rapid reaction of SCFD SiO 2 , resulting in the low density SiO 2 formation with high leakage current.Supercritical fluid deposition (SCFD) is an attractive deposition method for nanoscale device fabrication. Supercritical fluids are advantageous as solvents for their high diffusivity, high solubility, low viscosity, and low surface tension, resulting in excellent gap filling by SCFD. 1 Among various supercritical fluids, CO 2 has been widely studied for SCFD due to its relative low critical temperature, 31.2 • C, and pressure, 7.38 MPa. 2 CO 2 is also non-toxic and easily removable after processing. For these reasons, SCFD processes for Cu and Ru have been investigated for depositing barrier and seed layers in Cu interconnect technology. 3-7 Furthermore, low temperature SCFD processes below 200 • C of various oxides such as Al 2 O 3 , ZrO 2 , MnO 2 , RuO 2 , and HfO 2 have been reported. 8-10 Additionally, various film properties including conformality have been studied for SCFD of HfO 2 , ZrO 2 , and TiO 2 . 11 SiO 2 is one of the mostly widely used materials in the fabrication of Si devices. With downscaling of Si devices, complicated 3D structures are being extensively studied. Thus, the ability to deposit SiO 2 with high gap filling and good electrical properties is required more than ever. In this regard, SCFD is an attractive alternative to conventional deposition processes such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). Although several reports are available for SCFD SiO 2 , those are all on the fabrication of nanostructures using SCFD SiO 2 together with nanotemplate. [12][13][14][15][16] No detailed study is available yet on the growth characteristics and thin film properties of SCFD SiO 2 . We investigated SCFD of SiO 2 using metal-organic precursors and O 2 as a reactant. By varying deposition conditions, the growth characteristics and film properties were studied with a focus on applications for insulating layers such as shallow trench isolation for nanoscale semiconductor devices. In particular, the effects of reactant on the electrical properties were studied systematically.
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