Metal Rubber sheet and fabric materials and devices

Introduction to Solution‐Deposited Inorganic Electronics

“…Furthermore, the device characteristics must remain reasonably constant and metal interconnects must provide both low resistance and durable, rugged performance when the substrate is fl exed. 30 -33 Promising technology capable of yielding resistivity comparable with bulk metals, but rugged enough for thin, fl exible substrates has been achieved using directed self -assembly 34 and thermal spray deposition. 35,36 Both methods provide a means for room temperature deposition of a variety of metals and insulators for fabrication of passive electronic components.…”