Metallic Contact Formation for Molecular Electronics:  Interactions between Vapor-Deposited Metals and Self-Assembled Monolayers of Conjugated Mono- and Dithiols

Boer, Bart de; Frank, Martin M.; Chabal, Yves J.; Jiang, W.; Garfunkel, Eric; Bao, Zhenan

doi:10.1021/la0356349

Cited by 193 publications

(249 citation statements)

References 38 publications

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“…To do that, we deposited 3 nm of Ag on top of the SAM and measured by FTIR in an attenuated total reflection configuration the absorption of the SAM. 44 The coincidence of the characteristic stretching frequencies for COO-, CH 2 and CH 3 suggest that the SAM has not been substantially modified after the first steps of electrode deposition (Fig. 2).…”

Section: Sams To Passivate the Metal-semiconductor Interfacementioning

confidence: 90%

“…After substrate functionalization the most critical step in the fabrication of SAMs junctions is the deposition of the top electrode, as it can compromise the integrity of the underlying molecular layer. The influence of the deposition conditions has been widely studied in other systems, 28,[40][41][42][43] and soft-electrode transfer or indirect evaporation reported as the less harming methods to the SAM. In our case we have also found that direct metal evaporation is capable of maintaining the quality SAMs for low enough deposition rates and temperatures (see Experimental section for more details).…”

Section: Sams To Passivate the Metal-semiconductor Interfacementioning

confidence: 99%

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Molecular interfaces for plasmonic hot electron photovoltaics

2015

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Section: Sams To Passivate the Metal-semiconductor Interfacementioning

confidence: 90%

Section: Sams To Passivate the Metal-semiconductor Interfacementioning

confidence: 99%

Molecular interfaces for plasmonic hot electron photovoltaics

2015

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“…also Section 7.2, below). [34,67,69,70,92,[94][95][96] Beyond structure and morphology, several surface analyses, mainly spectroscopic ones, can provide information on the electronic structure of the system. As such information cannot be extracted directly from the transport data, the use of complementary methods is crucial for understanding transport mechanisms.…”

Section: Monolayer Characterizationmentioning

confidence: 99%

“…[67,69,70,92,[94][95][96]187] Evaporated Au or Cu on CH 3 ÀSi(111) interacts with the Si to form SiAu 3 or SiCu 3 , which detach the molecules from the surface. [67] Similarly, a monolayer of C 18 ÀSi(111) is generally destroyed by evaporation of Au or Ti, but not of Ag because of their different reactivity toward Si.…”

Section: Sources Of Defects and How To Avoid Themmentioning

confidence: 99%

Molecules on Si: Electronics with Chemistry

et al. 2009

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Basic scientific interest in using a semiconducting electrode in molecule‐based electronics arises from the rich electrostatic landscape presented by semiconductor interfaces. Technological interest rests on the promise that combining existing semiconductor (primarily Si) electronics with (mostly organic) molecules will result in a whole that is larger than the sum of its parts. Such a hybrid approach appears presently particularly relevant for sensors and photovoltaics. Semiconductors, especially Si, present an important experimental test‐bed for assessing electronic transport behavior of molecules, because they allow varying the critical interface energetics without, to a first approximation, altering the interfacial chemistry. To investigate semiconductor‐molecule electronics we need reproducible, high‐yield preparations of samples that allow reliable and reproducible data collection. Only in that way can we explore how the molecule/electrode interfaces affect or even dictate charge transport, which may then provide a basis for models with predictive power.To consider these issues and questions we will, in this Progress Report, review junctions based on direct bonding of molecules to oxide‐free Si. describe the possible charge transport mechanisms across such interfaces and evaluate in how far they can be quantified. investigate to what extent imperfections in the monolayer are important for transport across the monolayer. revisit the concept of energy levels in such hybrid systems.

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“…In this geometry, a Au substrate usually serves as a bottom electrode. The top electrode could be metal nanoclusters prepared by vacuum vapor deposition [1][2][3][4][5][6][7][8][9][10] or from a suspension of metal nanoparticles. [11][12][13][14] Previous studies have shown that vapor-deposited Au or Ag penetrates into the SAM and inserts into the thiol-Au bond at the Au/ SAM interface when it is vacuum-deposited on an alkanethiol SAM with a methyl end group.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Metal Deposition on Top of an Organic Monolayer

Uosaki

2006

J. Phys. Chem. B

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Electrochemical deposition of metals (platinum or gold) only on top of an organothiolate, 1,4-benzenedimethanethiol (BDMT) or hexanedithiol (HDT), self-assembled monolayer (SAM) on a Au(111) substrate was achieved by electrochemical reduction of PtCl 4 2-or AuCl 4 -ion, which was preadsorbed on one free thiol end group of the dithiol SAM formed on a Au surface, in a metal-ion-free sulfuric acid solution at potentials more negative than the reduction potential of the metal ion. Angle-resolved X-ray photoelectron spectroscopy (AR-XPS) measurement after the reduction of preadsorbed PtCl 4 2-ion on BDMT/Au(111) electrode showed the presence of Pt not underneath but on top of the BDMT SAM. After a negative potential scan of the Pt/BDMT/Au(111) electrode to -1.30 V in 0.1 M KOH solution, a typical cyclic voltammogram of a clean Au(111) electrode was obtained, showing that the BDMT SAM with a Pt layer was reductively desorbed. These results proved that a Pt-BDMT SAM-Au substrate sandwich structure without a short circuit between the two metals was successfully constructed by this technique. Furthermore, a decanethiol (DT) monolayer was constructed on a Au layer, which was formed by the reduction of preadsorbed AuCl 4 -ion on HDT/Au(111) electrode. The formation of DT/Au/HDT/Au(111) structure was confirmed as two cathodic peaks corresponding to reductive desorption of DT from Au on top of the HDT/Au(111) at -0.97 V and that of Au/ HDT from Au(111) at -1.12 V were observed when potential was scanned negatively to -1.35 V.

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Metallic Contact Formation for Molecular Electronics: Interactions between Vapor-Deposited Metals and Self-Assembled Monolayers of Conjugated Mono- and Dithiols

Cited by 193 publications

References 38 publications

Molecular interfaces for plasmonic hot electron photovoltaics

Molecular interfaces for plasmonic hot electron photovoltaics

Molecules on Si: Electronics with Chemistry

Electrochemical Metal Deposition on Top of an Organic Monolayer

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