Metallization of Polymers Using Plasma‐Enhanced Chemical Vapor Deposited Titanium Nitride as Interlayer

Weber, A.; Dietz, Andreas; Pöckelmann, R.; Klages, C.‐P.

doi:10.1149/1.1837544

Cited by 27 publications

(8 citation statements)

References 1 publication

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“…In fact, it is known that the adhesion force between a polymer and noble metal is generally low. [28][29][30][31] However, the surface texturing by the atmospheric pressure plasma improved the adhesion, as confirmed by the absence of an Ag pattern after the tape testing in the top sample picture of Fig. 10(a).…”

Section: Adhesion Properties Of the Ag Ink Pattern On Plasma Texture ...mentioning

confidence: 99%

Polymer surface texturing for direct inkjet patterning by atmospheric pressure plasma treatment

et al. 2012

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It would be beneficial if the substrate surface were treated to have hydrophobic properties, in order to keep the line pattern fine during the inkjet processing, while at the same time having improved adhesion properties on the substrate. In this study, a polyimide surface was textured using atmospheric pressure plasma treatment for fine line metal inkjet printing by micromasking the surface followed by etching the polyimide surface selectively. The water contact angle on the textured polyimide film was measured to be over 100 degrees, showing that the surface was hydrophobic. When the textured polyimide surface was printed on using an electro-hydro-dynamic inkjet for Ag line printing, not only fine line Ag printing, but also improved adhesion of Ag to the polyimide surface could be obtained while maintaining excellent resistivity. The improved adhesion properties in addition to the fine line patterning afforded by texturing the polyimide surface were caused by the increased surface contact area between the metal ink and the polyimide surface during the annealing of the Ag line.

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Section: Adhesion Properties Of the Ag Ink Pattern On Plasma Texture ...mentioning

confidence: 99%

Polymer surface texturing for direct inkjet patterning by atmospheric pressure plasma treatment

et al. 2012

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“…Hence, many researchers have studied the surface modification of polyimide for the purpose of improving its adhesion to metals. (9)(10)(11)(12) Since flexible electronic devices may be used at various temperatures, the peeling and disconnection of electrodes might be induced by stress caused by the difference in the thermal expansion coefficient between the polyimide substrate and the electrode material. Therefore, the reduction of the internal stress of the polyimide sheet with deposited Ge and the adhesion between the polyimide and Ge are important issues.…”

Section: Introductionmentioning

confidence: 99%

Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode

Tohnishi¹,

Sato²,

Matsutani³

et al. 2023

Sensors and Materials

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We demonstrated the surface treatment of polyimide using solid-source H 2 O plasma for the fabrication of Ge thin films as an electrode of flexible devices. By using the solid-source H 2 O plasma, the internal stress of a polyimide sheet with deposited Ge was decreased, and the adhesion between the polyimide and Ge was also improved. In addition, the solid-source H 2 O plasma treatment was effective for increasing the bending durability and decreasing the resistance of the Ge electrode on a polyimide surface. Moreover, we analyzed a polyimide surface treated with solid-source H 2 O plasma, by Fourier transform IR spectroscopy and X-ray photoelectron spectroscopy. We believe that the proposed solid-source H 2 O plasma process is useful for bonding between polyimide and Ge in the fabrication of flexible semiconductor electrodes.

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“…In electronic application, polyimide has been used to act as substrate material in flexible electronic technology. Hydrophobic surface characteristic is a limitation on the polyimide application, which results in poor wettability and adhesion [8,9]. One of feasible ways to enhance the wetting property is by using atmospheric pressure plasma treatment.…”

Section: Introductionmentioning

confidence: 99%

Surface treatment of polyimide using atmospheric pressure dielectric barrier discharge plasma

Riyanto¹

2020

ScienceAsia

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In this study, polyimide was treated by atmospheric pressure dielectric barrier discharge plasma using a helium and/or helium-oxygen mixture gasses. The polyimide was placed between copper electrodes with dielectric material installed on the cathode electrode. To investigate the surface treatment, the plasmas as a function of power, treatment time, and plasma gasses were introduced on the polyimide substrate. The experimental results show that the polyimide treated by dielectric barrier discharge plasma increases the wetting property. This property can be attributed to the surface roughness and the water compatible functional groups. The roughness increases by helium plasma treatment and can be further improved by increasing plasma power or the presence of oxygen in the helium-oxygen mixture plasma. On the other hand, the plasma surface treatment led to formation of oxygen related functional groups of −C− −O and −OH.

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Metallization of Polymers Using Plasma‐Enhanced Chemical Vapor Deposited Titanium Nitride as Interlayer

Cited by 27 publications

References 1 publication

Polymer surface texturing for direct inkjet patterning by atmospheric pressure plasma treatment

Polymer surface texturing for direct inkjet patterning by atmospheric pressure plasma treatment

Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode

Surface treatment of polyimide using atmospheric pressure dielectric barrier discharge plasma

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