Metallized polyimide films: Metallization and mechanism of the process

Abstract

The formation of metallized polyimide films in situ, namely, the alkaline hydrolysis of film surfaces, chelation of the modified surface with metal ions, and their chemical reduction giving rise to a metal layer, has been investigated. Initial polyimide films are cast from reaction solutions on a glass substrate. The solutions are prepared through the polycondensation of dianhydride of tricyclo[4.2.2.0 2.5 ]dec-7-ene-3,4,9,10tetracarboxylic acid and 4,4 1-diaminodiphenyl oxide in N-methyl-2-pyrrolidone at 160 ° C. It has been shown that alkaline water-alcohol solutions are optimal media for the hydrolysis of the film surface. The maximal exchange of alkali metal ions is achieved through formation of a more stable metal-ligand complex of poly(amido acid), with the chelation rate depending on the nature of a metal. The metal reduction proceeds rapidly; however, the mechanism of this process depends on the pH of a medium. The annealing of metallized films results in the imidization of poly(amido acid) and in the growth of metal grains on the material surface to yield a metal layer with good optical properties and high conductivity.

Fabrication and characterization of low-cost ultrathin flexible polyimide interposer

“…The metallization of PIs has therefore been the subject of intense study in recent years [18]. Copper (Cu) has attracted much attention for application in the interconnections of integrated circuits (IC) as a replacement for aluminum, due to its lower resistivity and high electro-migration resistance.…”

New Metalized Polyimide Films Structure and Physical Properties

“…Metalized thin-film constructs [1][2][3] are one of the current objectives of space materials research towards developing new reflective materials. Such devices have wide application as thermo-regulative coatings, light reflectors, collectors of solar energy, antennas and also in the screen-vacuumthermoisolation.…”

Metallized polyimide films for biomedical applications: X‐ray photoelectron spectroscopy, surface tension, and blood compatibility studies

“…The available reports mainly deal with commercial structures (Kapton) and highlight fundamental aspects regarding the mechanism of the metallization process, effect of the electron irradiation on thermal conduction of metalized PI, describe certain techniques of PI film metallization, while indicate the practical use as filters for X-Ray astronomy, circuit boards using TAB (tape automated bonding), magnetic tape and space applications. [26][27][28][29][30][31][32] For example, Ramos [33] performed a theoretical study on bonding strength of metal/Kapton commercial PI interface. By means of self-consistent molecular dynamics, it was shown that despite the low charge transfer between PI and selected metals (Cu, Ni, Cr), the bond formation generates charge rearrangement along the polymer atoms away from the reaction site.…”