The formation of metallized polyimide films in situ, namely, the alkaline hydrolysis of film surfaces, chelation of the modified surface with metal ions, and their chemical reduction giving rise to a metal layer, has been investigated. Initial polyimide films are cast from reaction solutions on a glass substrate. The solutions are prepared through the polycondensation of dianhydride of tricyclo[4.2.2.0 2.5 ]dec-7-ene-3,4,9,10tetracarboxylic acid and 4,4 1-diaminodiphenyl oxide in N-methyl-2-pyrrolidone at 160 ° C. It has been shown that alkaline water-alcohol solutions are optimal media for the hydrolysis of the film surface. The maximal exchange of alkali metal ions is achieved through formation of a more stable metal-ligand complex of poly(amido acid), with the chelation rate depending on the nature of a metal. The metal reduction proceeds rapidly; however, the mechanism of this process depends on the pH of a medium. The annealing of metallized films results in the imidization of poly(amido acid) and in the growth of metal grains on the material surface to yield a metal layer with good optical properties and high conductivity.

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Abstract:The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction of metals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electron beam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal-PI adhesion, which is the main problem to be overcome in all processes.The technology presented differs by the use of another chemical approach yielding electro-conductive materials with high reflectivity, but without damaging the films in the process. The metalized polyimide films have been prepared by heterogeneous chemical modification of the polyimide surface and the suggested technology includes several chemical conversion steps (hydrolysis, chelating by metal salts and reduction) requiring no complicated procedures and proceeding under mild conditions, at room temperature and without aggressive agents. This new process allows the formulation of metal phase while both simplifying the technology and making use of commercial PI films, such as Kapton HN and Upilex S.

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The new composite materials based on dianhydride of tricyclodecentetracarbon acid and oxydianiline with two other thermally stable polymers, such as polycarbonate and polysulphone, are being reported. The synthesis of the polyimide blends was done through two ways: mechanical mixing of two homopolymer  ingredients; and the so-called chemical mixing of polyimide comonomers with the above-mentioned polymers. The physico-chemical and physico-mechanical properties have been manifested in a broadening of their performance characteristics. It was not found any physical-chemical interactions between the two ingredients of the blend, which indicates the formation of a typical compatible polymer blend with an appropriate miscibility. Such new polyimide composite could be an ideal candidate for the preparation of reflective and conductive metallized polyimide blend films with wide mechanical performances.