2022
DOI: 10.1177/09544062221115578
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Metallurgical aspects and electrical resistivity of hardfaced pure copper layers over AISI 347 with cold metal transfer process

Abstract: Pure Copper having excellent electrical conductivity was deposited over AISI 347 substrate using Cold Metal Transfer (CMT) process to obtain quality weld overlays without defects. To improve the electrical conductivity post heat-treatment was performed. The microstructural examination revealed the presence of Cu-FCC and Fe-FCC along with retained delta ferrite at the bi-metallic interface. Also, the existence of bi-phasic spherulites rich in Fe and Cr were noticed in the weld overlay side while Cu spherulites … Show more

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