2016
DOI: 10.1557/mrs.2016.24
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Metamorphic III–V semiconductor lasers grown on silicon

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Cited by 49 publications
(29 citation statements)
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“…High quality GaSb thin ilms have been reported without resorting to several-µm-thick metamorphic bufer layers [18]. The prevailing approach to perform IMF growth of III-Sb on Si is to begin with an ultra-thin AlSb nucleation layer [19][20][21], such that a periodic array of 90°m isit dislocations, akin to those in the IMF growth of GaSb on GaAs, can be created. Apart from the advantages of the IMF growth mode, the thermal expansion coeficient of AlSb (2.55 × 10 -6 /K at 300 K) is very close to that of Si (2.59 × 10 -6 /K at 300 K).…”
Section: Fundamental Challenges In Iii-v Hetero-epitaxy On (001) Siliconmentioning
confidence: 99%
“…High quality GaSb thin ilms have been reported without resorting to several-µm-thick metamorphic bufer layers [18]. The prevailing approach to perform IMF growth of III-Sb on Si is to begin with an ultra-thin AlSb nucleation layer [19][20][21], such that a periodic array of 90°m isit dislocations, akin to those in the IMF growth of GaSb on GaAs, can be created. Apart from the advantages of the IMF growth mode, the thermal expansion coeficient of AlSb (2.55 × 10 -6 /K at 300 K) is very close to that of Si (2.59 × 10 -6 /K at 300 K).…”
Section: Fundamental Challenges In Iii-v Hetero-epitaxy On (001) Siliconmentioning
confidence: 99%
“…Another advantage is the high refractive index contrast of silicon-on-insulator (SOI) waveguides, which enables a very dense integration of photonic components [1,2]. Conversely, the narrow bandgap of the compound semiconductor GaSb and related heterostructures is commonly utilized for optoelectronic devices in the infrared (IR) wavelength regime [3][4][5][6][7]. Hence, the monolithic integration of GaSb-based heterostructures on Si substrates would lead to cost-efficient on-chip sensing applications which take advantage of the unique optoelectronic properties of III-V materials on the one hand and of the established and scalable fabrication of silicon-based photonics integration circuits (PICs) on the other hand.…”
Section: Introductionmentioning
confidence: 99%
“…As optoelectronic device performance degrades quickly with the presence of relaxation defects, it is important to achieve a high crystal quality in the active device area and to separate the latter clearly from the region of plastic relaxation. Different methods have been investigated to reduce the defect density in the active layer stack, e.g., the growth of a thick metamorphic buffer or the implementation of defect filter layers such as strained layer superlattices [4,[12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…O VER the last few years, an almost exponential growth in global internet traffic has raised significant challenges for the modern Datacentre and Datacom industries, which require an efficient interconnection framework to support the large bandwidth demand with low power consumption. These demanding requirements have created a major "bottleneck" for conventional copper interconnections in transporting digital information on different scales, ranging from worldwide links to inter-and intra-chip communications [1], [2]. The integration of optical interconnects with photonic integrated circuits (PICs) on a silicon platform has become one of the most promising candidates to solve this problem [3]- [10].…”
Section: Introductionmentioning
confidence: 99%