1998
DOI: 10.1088/0960-1317/8/1/006
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Method for fabrication of microfluidic systems in glass

Abstract: In this report we describe a new way of fabricating integrated microfluidic elements in glass. By employing a matrix of underpinning posts and a thin wall, surrounding etched flow channels, an efficient sealing of glass chips substrates to thin cover glass can be accomplished. The use of this arrangement enables the overlay sheath of glass to hermetically close the flow channel by fusion bonding while avoiding problems with void or crack formation that are due to dust particles, non-planarity and differences i… Show more

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Cited by 174 publications
(118 citation statements)
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“…The etch was performed for 90 min at 25°C with propeller agitation in equal parts of deionized water, 1 M hydrochloric acid, and buffered oxide etchant (6 ammonium fluoride:1 hydrofluoric acid, Transene Company). Hydrochloric acid was used to prevent the redeposition of insoluble fluoride salts (30). The etch was performed for 90 min at 25°C for a maximum well depth of 80 m. The slides were first washed in acetone to remove the photoresist and then cleaned in an acid bath (NanoStrip Cyantek, Fremont, CA).…”
Section: Methodsmentioning
confidence: 99%
“…The etch was performed for 90 min at 25°C with propeller agitation in equal parts of deionized water, 1 M hydrochloric acid, and buffered oxide etchant (6 ammonium fluoride:1 hydrofluoric acid, Transene Company). Hydrochloric acid was used to prevent the redeposition of insoluble fluoride salts (30). The etch was performed for 90 min at 25°C for a maximum well depth of 80 m. The slides were first washed in acetone to remove the photoresist and then cleaned in an acid bath (NanoStrip Cyantek, Fremont, CA).…”
Section: Methodsmentioning
confidence: 99%
“…If the masking layer presents a hydrophilic surface, the etching solution will easily penetrate through this crack and generate a pinhole. Many masking materials for wet etching of glass have been reported in the literature, including photoresist, 52 amorphous Si deposited at low (200 C) 53 or high temperatures (570 C), 54 LPCVD polysilicon, 55,56 Cr/Au, 57 Cr/photoresist, 58 bulk Si, 59 amorphous SiC/ PECVD, 60 Ag, 61 Mo, 62 and Ti. 63 A detailed analysis of masking materials used in wet etching of glass is presented in Ref.…”
Section: Wet Etchingmentioning
confidence: 99%
“…The fabrication material for microfluidic systems has gone through several iterations, starting from the original silicon-based semiconducting materials (Ratner et al 2005), to glass (Stjernstrom and Roeraade 1998), and to the latest organic polymers such as PMMA (polymethylmethacrylate) and PDMS, with PDMS being the most popular and widely used in recent years. As a microfabrication material, PDMS has a number of wellestablished advantages over silicon and glass including low cost, robustness, and biocompatibility (Thangawng et al 2007).…”
Section: Introductionmentioning
confidence: 99%