Methods used in the extraction of lithographic modelling parameters for simulation packages such as PROLITHJ2' are examined. The results reveal hitherto unconsidered aspects of the development process which, when implemented in the simulations, give improved agreement with practical results with regard to characteristics such as resolution, depth-of-focus, linearity and dense/isolated bias.These refinements, which are particularly influential in the sub-half-micron regime, include the variation in photoresist dissolution properties as a function of depth into the resist film and also a small but powerful development "notch" which is observed in the development rate vs. PAC concentration curve as it approaches the minimum dissolution rate.This work therefore shows that current development models may not be adequate for some applications, and that great care must be taken in deriving and using the correct set of parameters for any one situation.