Methods of analysing thermomechanical stress in plastic packages for integrated circuits

Slattery, Orla; Hayes, T.; Lawton, W.; Kelly, G.; Lyden, C.; Barrett, J.; O’Mathuna, Cian

doi:10.1016/0924-0136(95)01942-1

Cited by 19 publications

(3 citation statements)

References 3 publications

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“…The fabrication process of a complete packaged IC is a tricky one, as it involves the use of different materials of distinct coefficients of thermal expansion (CTEs), e.g. die bond pad, die attach adhesive/epoxy glue, moulding compounds and Cu-filled through-silicon-vias (TSVs) [2][3][4][5][6]. Thermal stress and warpage are frequently generated in the packaged chip during the thermal processing steps as a consequence of the CTE mismatch of these materials [7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Wong¹,

Bennett²,

Manessis³

et al. 2014

Microelectronic Engineering

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Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip (SoC) or System-in-Package (SiP), which is identified as a requirement by the International Technology Roadmap for Semiconductors (ITRS). In the work presented here, a triple-axis Jordan Valley Bede D1 X-ray diffractometer is used to develop a novel lab-based technique called X-ray diffraction 3-dimensional surface modeling The feasibility of this technique is confirmed through the charactersation of die stress inside 2 encapsulated commercially available ultra-thin Quad Flat Non-lead (QFN) packages, as well as die stress in embedded QFN packages at various stages of the chip manufacturing process.

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Section: Introductionmentioning

confidence: 99%

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Wong¹,

Bennett²,

Manessis³

et al. 2014

Microelectronic Engineering

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“…An understanding of the visco-elastic-plastic characteristics of epoxy molding compounds is necessary to guarantee the reliability of IC performance. Thus far, many studies have been done on the thermo mechanical behavior of IC packages and epoxy molding compounds [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. However, mainly elastic or viscoelastic analysis has been carried out.…”

Section: Introductionmentioning

confidence: 99%

Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits

Saiki

Marumo

Nishitake

et al. 2006

AMR

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Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.

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“…Suhir 52 evaluated the elastic stability of an epoxy cap in a flip-chip package design. Slattery et al 53 analyzed methods for predicting thermal stresses in plastic packages. Huang et al 54 modeled the possible occurrence of voiding in plastic packages.…”

Section: Thin Films Polymeric Materials and Plastic Packages Of Ic Dmentioning

confidence: 99%

Materials and Thermal Management

2011

Advancing Microelectronics Magazine

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Methods of analysing thermomechanical stress in plastic packages for integrated circuits

Cited by 19 publications

References 3 publications

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits

Materials and Thermal Management

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