2016
DOI: 10.15199/13.2016.1.2
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Metody pasywacji nowoczesnych struktur detektorów podczerwieni

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Cited by 3 publications
(4 citation statements)
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“…The mesa formation was achieved with 1.5 µm etching depth by using CH 3 COOH=HNO 3 =HF etching solution. 21) Devices with different mesa sizes 300 × 300, 200 × 200, and 100 × 100 µm 2 are fabricated for comparison. After the mesa formation, to prevent the sidewall leakage current, the samples were passivated by soaking in the (NH 4 ) 2 S aqueous solution for 60 min at room temperature.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…The mesa formation was achieved with 1.5 µm etching depth by using CH 3 COOH=HNO 3 =HF etching solution. 21) Devices with different mesa sizes 300 × 300, 200 × 200, and 100 × 100 µm 2 are fabricated for comparison. After the mesa formation, to prevent the sidewall leakage current, the samples were passivated by soaking in the (NH 4 ) 2 S aqueous solution for 60 min at room temperature.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…As it was stated in Ref. [23], the implementation of GaSb-based alloys in device technology is depended on reproducible control of their surface properties. In this view, the real GaSb surfaces are modified by technological processes namely cutting, smoothing, or mechanical polishing of semiconductor wafer a fact that conduced to surface damage regions.…”
Section: Surface Modificationmentioning
confidence: 99%
“…The irreversibility character of the reactions implies that oxygen atoms, rather than molecules are ultimately involved in chemical bonding. It is important to note [23] that for oxygen involved there is a movement from the chemisorption concept (i.e., adsorbed layer structure is a function of underlying surface) to the complex formation concept characterized by a film with its own chemical and structural identity. The effect of Ar + ion etching on n-GaSb native oxides for different voltages and etching times can be observed from XPS spectra, i.e., C1 (0.5 kV, t 1 = 3 minutes); C2 (1 kV, t 2 = 3 minutes); C3 (1 kV, t 3 = 5 minutes); C4 (2 kV, t 4 = 10 minutes).…”
Section: Surface Modificationmentioning
confidence: 99%
“…Despite many investigations [7][8][9][10][11][12][13][14][15][16][17][18][19][20][21], a fully convincing demonstration of helical edge states in the topological insulating phase in this material system is still elusive, although the tunability between normal to topological nontrivial insulating phases was proven with a dual gated approach [14]. Due to the peculiarities of the so-called 6.1Å material system (InAs, GaSb, and AlSb), e.g., the Fermi level pinning of InAs in the conduction band [22][23][24], additional parasitic surface conducting properties of oxidized antimonides [25][26][27], and the leakage currents of the back gate via defect states [28] make it difficult to analyze transport phenomena in InAs/GaSb DQWs and to observe topological nontrivial phases via a dual gating approach.…”
mentioning
confidence: 99%