2019
DOI: 10.1002/admi.201900429
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Mg Deficiency in Grain Boundaries of n‐Type Mg3Sb2 Identified by Atom Probe Tomography

Abstract: Highly resistive grain boundaries significantly reduce the electrical conductivity that compromises the thermoelectric figure‐of‐merit zT in n‐type polycrystalline Mg3Sb2. In this work, discovered is a Mg deficiency near grain boundaries using atom‐probe tomography. Approximately 5 at% of Mg deficiency is observed uniformly in a 10 nm region along the grain boundary without any evidence of a stable secondary or impurity phase. The off‐stoichiometry can prevent n‐type dopants from providing electrons, lowering … Show more

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Cited by 50 publications
(38 citation statements)
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“…While initially attributed to ionized impurity scattering, [ 3,23–25 ] there has been growing evidence supporting that this low‐temperature behavior stems from thermally activated grain‐boundary resistance. [ 20–22,26 ] The effect is more pronounced for Sb‐rich alloys, particularly Mg 3 Sb 2 . [ 5 ] Additionally, a previous grain boundary resistance model study predicted more than 50% improvement of the room‐temperature weighted mobility if the grain boundary resistance is completely removed.…”
Section: Figurementioning
confidence: 99%
“…While initially attributed to ionized impurity scattering, [ 3,23–25 ] there has been growing evidence supporting that this low‐temperature behavior stems from thermally activated grain‐boundary resistance. [ 20–22,26 ] The effect is more pronounced for Sb‐rich alloys, particularly Mg 3 Sb 2 . [ 5 ] Additionally, a previous grain boundary resistance model study predicted more than 50% improvement of the room‐temperature weighted mobility if the grain boundary resistance is completely removed.…”
Section: Figurementioning
confidence: 99%
“…Moreover, they predicted a large improvement in the room temperature zT if the grain boundary resistance is eliminated. Later, using atom probe tomography, the grain boundary phase is identified to be Mg-deficient (approximately 5 at%) ( Figure 6(b) ), which is attributed to be responsible for the high grain boundary resistance [ 98 ]. Aiming at improving the μ and σ near RT by suppressing the grain boundary resistance, one direct way is to simply reduce the number of grain boundaries to get coarse-grained polycrystalline samples, which can be achieved by either increasing the sintering temperature [ 78 , 82 ] or post-annealing under Mg atmosphere if initial grain sizes are small [ 82 ].…”
Section: Optimization Of Te Propertiesmentioning
confidence: 99%
“…Hence, a deep microstructure analysis to know the grain boundary region better with advanced techniques is highly necessary [ 184 , 185 ]. For n -type Mg 3 Sb 2 polycrystalline samples, the grain boundary phase is found to be a 10 nm region with Mg deficiency [ 98 ], resulting in the high electrical resistance. One possible indication thereby is if there are ways to make the grain boundary phase have an equal or even lower resistance than the matrix, the “anomalous” μ ( T ) and σ ( T ) near RT might vanish.…”
Section: Optimization Of Te Propertiesmentioning
confidence: 99%
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“…Kuo et al explored the defect compositions near the grain boundary of Mg 3.05 Sb 1.99 Te 0.01 (nominal composition) using 3D atom-probe tomography (APT) ( Figure 3(c) ), from which the planar defect is clearly noticeable (as marked by the arrow), and it is a maximum 5 at. % Mg deficiency [ 56 ]. As discussed above, a Mg deficiency could easily induce a high Mg vacancy ( V Mg 2- ) concentration in the vicinity of the boundary and result in the depletion of free n-type carriers since V Mg 2- serves as an effective electron-killing defect ( Figure 3(d) ).…”
Section: Manipulating the Carrier-scattering Mechanismmentioning
confidence: 99%