2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2019
DOI: 10.1109/eurosime.2019.8724559
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Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications

Uwe Zschenderlein
1
,
Markus Klingler
2
,
J. Arnold
3
et al.
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Interaction of advanced copper metallization with the assembly and interconnection technology

Losbichler
1
,
Klingler
2
,
Orso
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Interaction of advanced copper metallization with the assembly and interconnection technology

Losbichler
1
,
Klingler
2
,
Orso
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
1
0
0
0
View full textAdd to dashboardCite

Interaction of advanced copper metallization with the assembly and interconnection technology

Losbichler
1
,
Klingler
2
,
Orso
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
1
0
0
0
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Determination of Temperature Dependent Young’s Modulus of Sintered Silver (SAG) by Vibration Tests

Heilmann,
Türk,
Forndran
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
1
0
0
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