2010
DOI: 10.1016/j.mee.2009.08.030
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Micro-deformation of flexible substrate for electronic devices during handling prior to lithography patterning

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Cited by 11 publications
(10 citation statements)
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“…The second effect of temperature elevation on the polymeric substrates is a reduced dimensional stability due to a high coeffi cient of thermal expansion, even for biaxially oriented and thermally stabilized foils. [ 88 ] The dimensional stability and waviness of the foils can be improved by a bond-debond approach, temporarily laminating and fl attening the foil to a carrier (e.g., Si or glass). These foilon-carriers supply a stable platform for foil processing, but many new variables are introduced (e.g., bowing) and need to be studied and tuned.…”
Section: Progress Reportmentioning
confidence: 99%
“…The second effect of temperature elevation on the polymeric substrates is a reduced dimensional stability due to a high coeffi cient of thermal expansion, even for biaxially oriented and thermally stabilized foils. [ 88 ] The dimensional stability and waviness of the foils can be improved by a bond-debond approach, temporarily laminating and fl attening the foil to a carrier (e.g., Si or glass). These foilon-carriers supply a stable platform for foil processing, but many new variables are introduced (e.g., bowing) and need to be studied and tuned.…”
Section: Progress Reportmentioning
confidence: 99%
“…PEN and PET have been widely employed for manufacturing flexible electronics, and these substrates are prone to non-linear deformations induced by heat, moisture, and mechanical stress 7,8 . Previous research has shown that mask-based lithography may be successfully employed for manufacturing transistors on plastic foils temporarily laminated on top of a rigid carrier 1 .…”
Section: Introductionmentioning
confidence: 99%
“…Linear deformations of the substrate would be relatively easy to account for in mask-based lithography by simply changing the magnification of the projected image, or the projected pattern. However, on plastic substrates shrinkage and expansion of the substrate could occur at the same time and on the same foil depending on the monitored direction, a result of foil anisotropy 7 . It is thus difficult to cope with these deformations on the fly, and a good solution would be projection of the corrected image without a mask.…”
Section: Introductionmentioning
confidence: 99%
“…The second effect of temperature elevation on the polymeric substrates is a reduced dimensional stability due to a high coefficient of thermal expansion, even for biaxially oriented and thermally stabilized foils. [86] The dimensional stability and waviness of the foils can be improved by a bond-debond approach, temporarily laminating and flattening the foil to a carrier (e.g. Si or glass).…”
Section: Resolution Patterningmentioning
confidence: 99%
“…bowing) and need to be studied and tuned. [25,[86][87][88][89][90] Other bonding strategies developed are Electronics-on-Plastic by Laser Release (EPLaR) by Philips Research, [91] and Flexible Universal Plane for Display (FlexUPD) by ITRI. [92] In EPLaR, PI is coated on display glass as used in TFT-LCD processing plants.…”
Section: Resolution Patterningmentioning
confidence: 99%