2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) 2014
DOI: 10.1109/memsys.2014.6765846
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Micro devices integration with large-area 2D chip-network using stretchable electroplating copper spring

Abstract: This study presents a large-area multi-devices integration scheme using stretchable electroplated copper spring. Each device is located on the silicon-node of a 2D chip-network distributed, which are mechanically and electrically connected to surrounding devices by stretchable copper spring. The springs stretch and expand the functional devices by several orders of magnitude area forming a variable-density network of interconnected devices. Advantages of this approach include: (1) using existing process techno… Show more

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Cited by 5 publications
(5 citation statements)
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“…After that, the splitting trenches (by dicing saw) were used to separate each node. Detailed process steps are explained in [20]. Finally, as shown in figure 3(g), the chip network was ready to be stretched for large-area deployment.…”
Section: Fabrication Process and Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…After that, the splitting trenches (by dicing saw) were used to separate each node. Detailed process steps are explained in [20]. Finally, as shown in figure 3(g), the chip network was ready to be stretched for large-area deployment.…”
Section: Fabrication Process and Resultsmentioning
confidence: 99%
“…Thus, this study extends the concept in [20] to design and implement a chip network integrated with functional devices. Electroplated copper is chosen to act as the stretchable spring because of its mechanical and electrical properties.…”
Section: Introductionmentioning
confidence: 90%
See 1 more Smart Citation
“…However, it is challenge to integrate these technologies with traditional semiconductor/MEMS processes/devices. Thus, this study extends the concept in [10] to design a flexible PDMS-fiber integrated with multi devices scheme. The PDMS-fiber provides solid nodes for the implementation and integration of micro devices.…”
Section: Introductionmentioning
confidence: 81%
“…Another bridge pattern that can achieve high stretchability and strain insensitivity is the 2D spiral, which is characterized by a curve winding around a fixed point (Figure 3c). [181,182] The 2D spiral unwinds and straightens under stretching, and the spiral arm absorbs the stretching strain and ensures the islands are free of strain. [125] During the unwinding process, the spiral is only loaded by bending strain, which has a limited influence on the conductance of the bridge.…”
Section: Wwwadvelectronicmatdementioning
confidence: 99%