Micro-electroforming under periodic vacuum-degassing and temperature-gradient conditions

Ming, Pingmei; Zhu, Donghui; Hu, Yang; Zeng, Yong

doi:10.1016/j.vacuum.2009.03.032

Cited by 22 publications

(4 citation statements)

References 12 publications

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“…Ming et al [147] achieved a considerable reduction in pitting defects of the electroformed micromesh by using a vertical temperature gradient (25 • C/65 • C) that served to eliminate hydrogen. A high-quality micromesh with rib-width of about 20 µm and thickness of about 120 µm was obtained by electroforming, as shown in figure 21.…”

Section: Temperaturementioning

confidence: 99%

Advances in precision micro/nano-electroforming: a state-of-the-art review

Zhang

Gilchrist

2020

J. Micromech. Microeng.

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Micro/nano-electroforming has received considerable interest from various industry sectors as an advanced micro-manufacturing technique that offers high dimensional precision and replication accuracy. When tight feature tolerances and miniaturized geometries are required, electroforming provides unique advantages and cost-effective characteristics for fabrication. This paper firstly reviews the historical development of micro-electroforming, particularly within the past two decades. The fundamentals of electroforming and relevant applications are firstly discussed, and the common requirements are then proposed. Based on these requirements, we have focused on the processes of micro-electroforming from the ultraviolet lithography, electroplating, and moulding process to electroforming process characterization and optimization, bath compositions, agitation, and some hybrid processes. Progress from electrochemical micro/nano-manufacturing processes, such as 3D printing by electrodeposition and electrochemical wet stamping, is also included. The eventual nanocomposite electroforming is highlighted from the perspectives of the formation mechanism, deposition properties and relevant applications. Finally, a conclusion and future perspectives are presented. This review will demonstrate how the micro/nano-electroforming process can be further developed to meet the requirements of new product development from precision optics, micro/nano-moulding, high-performance coatings and future micro/nano-manufacturing.

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Section: Temperaturementioning

confidence: 99%

Advances in precision micro/nano-electroforming: a state-of-the-art review

Zhang

Gilchrist

2020

J. Micromech. Microeng.

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“…With this technique, they produced bright Ni deposits with smooth surface and few pits. We developed another new technique, that is, electroforming under periodic vacuum-degassing and temperature-gradient conditions, for the production of void-free micro-components, and Ni micro-coils with few pinhole and nodule defects were produced [7]. However, little information on the morphology and microhardness of the macro-deposits obtained using this technique was available.…”

Section: Introductionmentioning

confidence: 99%

Morphology and Microhardness of Nickel Electroformed under Vacuum-Degassing Conditions

Ming

2010

KEM

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Ni deposits were prepared from a nickel sulfamate type electrolyte bath under vacuum-degassing and temperature-gradient conditions without any additives. Morphology and microhardness of the deposits obtained at the current density of 1A/dm2, 3A/dm2, 5A/dm2 and 7A/dm2 were examined and analyzed. Experimental results showed that the deposits obtained under vacuum-degassing and temperature-gradient conditions exhibited fewer pinhole defects and finer grain size comparing with those formed under conventional deposition conditions, and that the microhardness of the deposits was greater than that from conventional deposition conditions without additives while lower than that from conventional deposition conditions with additives. Under the vacuum-degassing conditions, the electroforms had remarkably smoother surface with fewer void defects and finer grain size, and considerably microhardness.

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“…As the thickness increases, Ag coating is prone to defects such as holes, cracks, etc As a result, the deposition quality is affected and even the coating fails. 20 Among various origins, internal stress is a crucial factor affecting the stability of thick Ag deposition and coating performance. The internal stress of metal coatings is usually caused by the unbalanced crystallization process, relating to nucleation mechanisms and electrochemical parameters throughout the electro-crystallization.…”

mentioning

confidence: 99%

Non-Cyanide Thick Silver Electrodeposition Base on Instantaneous Nucleation for 3D Microstructures with High Performance

Cai¹,

Li²,

Wu³

et al. 2023

J. Electrochem. Soc.

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To meet the diversified development of electronics, it is essential to develop 3D metal microstructures with high performance. However, 3D thick silver forming is still a challenge due to high internal stresses and defects. Here we proposed a method for the thick Ag electrodeposition with low-stress and high chemical stability for 3D Ag-based microstructures. We carried out systematic studies through electrochemical measurements, morphological characterization, micro-texture analysis, internal and stability examination. The results show that the nucleation mechanism of electroplating Ag is transformed from progressive nucleation to instantaneous nucleation through the coordinated control of current density and temperature. Higher temperature and lower deposition potential are preferred to form the large-grained crystallization. Additionally, the external parameters for fabricating Ag coating were optimized, and the correlation between micro-texture and internal stress was also verified. The feasibility of thick Ag preparation process was demonstrated by extending the electroplating time, showing excellent performance. Finally, 3D Ag micropillar arrays with the height of 577 µm and the high aspect ratio close to 3 were fabricated by MEMS techniques, displaying satisfied 3D forming ability. This work presents a new approach for manufacturing the 3D Ag microstructures and lays foundation for the multi-functionalization Ag-based devices.

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Micro-electroforming under periodic vacuum-degassing and temperature-gradient conditions

Cited by 22 publications

References 12 publications

Advances in precision micro/nano-electroforming: a state-of-the-art review

Advances in precision micro/nano-electroforming: a state-of-the-art review

Morphology and Microhardness of Nickel Electroformed under Vacuum-Degassing Conditions

Non-Cyanide Thick Silver Electrodeposition Base on Instantaneous Nucleation for 3D Microstructures with High Performance

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