2004
DOI: 10.1016/j.jmatprotec.2003.10.060
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Micro-fabrication of crystalline silicon by controlled alkali etching

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Cited by 18 publications
(11 citation statements)
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“…14 Therefore, Fulong et al concluded that K + and Na + cations do not affect the etching rate and shapes of micro-island formations. 14 60%, 24%, and 10 wt% concentrations, respectively. 11 Even though a comparison between the same concentration was not made for all solutions, it was stated that no significant difference in etching behavior could be found when comparing LiOH, NaOH, and KOH.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…14 Therefore, Fulong et al concluded that K + and Na + cations do not affect the etching rate and shapes of micro-island formations. 14 60%, 24%, and 10 wt% concentrations, respectively. 11 Even though a comparison between the same concentration was not made for all solutions, it was stated that no significant difference in etching behavior could be found when comparing LiOH, NaOH, and KOH.…”
Section: Methodsmentioning
confidence: 99%
“…The etching of silicon has been demonstrated to be dependent on dopants, the silicon orientation, etchants, ,, and additives. , The vast majority of this earlier literature has focused on silicon etching for the application of microfabrication. Therefore, most studies have evaluated the corrosion of silicon through topological studies or weight loss measurements.…”
Section: Introductionmentioning
confidence: 99%
“…The SiC oxidation reaction is extremely slow at room temperature, and even at high‐temperature and in an oxygen or ozone atmosphere the SiC oxidation rate remains ≈0.1 nm min −1 , [ 21 ] which greatly limits the removal rate of the material in the subsequent hydrofluoric acid (HF) etching. As such, some traditional wet chemical etching methods [ 22,23 ] for rapid silicon etching are no longer applicable for SiC etching.…”
Section: Introductionmentioning
confidence: 99%
“…extremely slow at room temperature, and even at high-temperature and in an oxygen or ozone atmosphere the SiC oxidation rate remains ≈0.1 nm min −1 , [21] which greatly limits the removal rate of the material in the subsequent hydrofluoric acid (HF) etching. As such, some traditional wet chemical etching methods [22,23] for rapid silicon etching are no longer applicable for SiC etching. To address the slow oxidation rate of SiC, several methods have been proposed, which can be classified as external-biasassisted wet etching and external-bias-free wet etching.…”
mentioning
confidence: 99%
“…This process is selected because of its repeatability, fabrication in uniformity, and low production cost. In this technique, the hydroxyl ions react with silicon atoms of the exposed surfaces, which are dissolved during wet etching processes [4]. This technique is depending on strong oxidizing agent (KOH as an etchant), it has the important characteristics (i.e.…”
Section: Introductionmentioning
confidence: 99%