Micro milling of sintered tungsten–copper composite materials

Uhlmann, Eckart; Piltz, Sascha; Schauer, Kai

doi:10.1016/j.jmatprotec.2005.05.022

Cited by 74 publications

(36 citation statements)

References 2 publications

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“…has been undertaken [8,[15][16][17][18][19][20][21][22]. Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions.…”

Section: Introductionmentioning

confidence: 99%

“…Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions. Examples are process intrinsic inhomogeneities and the inclusion of pores, limitations regarding obtainable compositions and restrictions on minimum microstructural length scales [8,[15][16][17][18][19][20][21][22]. Sputter deposition in contrast presents the opportunity to homogeneously distribute several elements simultaneously [9,23].…”

Section: Introductionmentioning

confidence: 99%

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From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

2015

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“…has been undertaken [8,[15][16][17][18][19][20][21][22]. Sintered parts, however, are susceptible to several kinds of inherent defects and restrictions.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

2015

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“…We can calculate the whole possible combinations in advance, because the amount of system input and output domain elements is finite. When practically controlling, we can merely check controlling rule table [4] [5].…”

Section: Fuzzilization Of Output Variable：mentioning

confidence: 99%

Research on Electrical Discharge Machining Intelligent Control Arithmetic

Fu¹,

Gao²,

Li³

2015

Proceedings of the 2015 International Industrial Informatics and Computer Engineering Conference

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Abstract.A new vibration device of process electrode has been provided in the paper, which achieves the aim of developing process state and improving process speed. Set out from improving system process efficiency and process quality, it analyses the characteristics of EDM and make sure appropriate parameter and control system configuration. Combined the characteristics of fuzzy controller and artificial nerve net, it designs portable EDM nerve fuzzy control system, which uses in adjusting the parameter of servo control system and revises some disadvantages of faulty rule to improve quick respond capacity of control system. Applying fuzzy theory and simulation means, it analyses the portable EDM servo control system and proves the stability of the EDM control system in theory. Through typical experiments, the process efficiency of device has been testified.

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“…Taking into account the specific scale constraints in micromilling, the resulting surface roughness is even more important because it would be very difficult or even impossible to apply any follow-up processing, and thus to improve the surface quality [3]. Therefore, it is not surprising that many researchers have investigated the mechanism and the factors affecting the surface generation during the micromachining process [4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

“…Uhlmann et al [11] reported an experimental study on micromilling sintered tungsten-copper (WCu) composite materials with different ratios of W and Cu and with microstructures as shown in Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Modeling the Material Microstructure Effects on the Surface Generation Process in Microendmilling of Dual-Phase Materials

Elkaseer

Dimov

Popov³

et al. 2012

Journal of Manufacturing Science and Engineering

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The anisotropic behavior of the material microstructure when processing multiphase materials at microscale becomes an important factor that has to be considered throughout the machining process. This is especially the case when chip-loads and machined features are comparable in size to the cutting edge radius of the tool, and also similar in scale to the grain sizes of the phases present within the material microstructure. Therefore, there is a real need for reliable models, which can be used to simulate the surface generation process during microendmilling of multiphase mate rials.This paper presents a model to simulate the surface generation process during microendmilling of multiphase materials. The proposed model considers the effects of the following factors; the geometry of the cutting tool, the feed rate, and the workpiece material microstructure. Especially, variations of the minimum chip thickness at phase boundaries are considered by feeding maps of the material microstructure into the model. Thus, the model takes into account these variations that alter the machining mechanism from a proper cut-. Assoc. Editor: Komel Ehmann. ting to ploughing and vice versa, and are the main cause of microburr formation. By applying the proposed model, it is possible to estimate more accurately the resulting roughness because the microburr formation dominates the swface generation process during microendmilling of multiphase materials. The proposed model was experimentally validated by machining two different samples of dual-phase steel under a range of chip-loads. The roughness of the resulting swfaces was measured and compared to the predictions of the proposed model under the same cutting conditions. The results show that the proposed model accurately predicts the roughness of the machined surfaces by taking into account the effects of material multiphase microstructure. Also, the developed model successfully elucidates the mechanism of microburr formation at the phase boundaries, and quantitatively describes its contributions to the resulting swface roughness after microendmilling.

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Micro milling of sintered tungsten–copper composite materials

Cited by 74 publications

References 2 publications

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films

Research on Electrical Discharge Machining Intelligent Control Arithmetic

Modeling the Material Microstructure Effects on the Surface Generation Process in Microendmilling of Dual-Phase Materials

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