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Micro rotational parts within a diameter range between 10 micron and 1 mm are used in several industrial sectors. Well-known applications are micro shafts of gears, ejector pins in forming tools, pin electrodes for micro electrical discharge drilling or micro stamping dies. Depending on the geometrical complexity of micro rotational parts different process variants of micro electrical discharge machining characterized by a rotating work piece can be used: wire electrical discharge grinding (WEDG) with fine wire electrodes, electrical discharge turning (EDT) with micro structured tool electrode, cylindrical electrical discharge grinding (CEDG) with micro profiled disk electrode. Characteristic to these process variants is the superimposed relative motion between the rotating electrodes and the feed. This relative motion can be varied in a wide circumferential velocity range to improve the material removal process. The paper gives an overview of kinematic and technological restrictions and requirements of the WEDG process influencing the process behavior with respect to the technological requirements of micromachining. Entnommen aus TEMA

The paper shows the potentials of micro electrical discharge grinding (Il-EDG) for the production of microstructured tools for forming techniques. EDG is a process variant using a rotating disk electrode where the EDM process is superimposed by kinematics close to those of peripheral shape grinding. This way it is possible to manufacture long channels on large surfaces without using form electrodes. Beginning with the analytic description of characteristics and active mechanisms of Il-EDG, the influence of major parameters on process behavior is to be investigated. The objective of the experimental investigations is the determination of fundamentals for the development of compensation techniques to minimize process-caused tool wear effects on geometrical accuracy. Furthermore the influence of process technology on working results regarding obtainable surface quality and removal rate will be examined.