Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Mechanical Behavior of Sintered Nano-sized Ag Particles

“…The elastic modulus of the compact portion at an ambient temperature is extremely low, about one fourth of that (83GPa) of bulk Ag. Recently, it has been reported that Cu film fabricated by plating has low elastic modulus due to low quality grain boundaries 14), 15) . In consideration of this along with very low fracture elongation in the tensile test, it is predicted that sintered nano-sized Ag particles have the grain boundaries of lower quality where bonding interface between Ag particles is weak compared to bulk Ag.…”

“…Porous grain boundary CI value Table 3 Schematic illustration of grain boundary structure categorized by the combination of the CI values 15) . …”

“…Although the transmission electron microscope is commonly used for the examination of grain boundaries, the technique of using the CI (Confidence Index) derived from crystallographic orientation analysis based on the electron backscatter diffraction patterns (EBSD) 15) was employed in this study because of the brittleness of the specimen and difficulty in preparing a thin film. CI is the parameter indicating a degree of accuracy of the orientation determination.…”