Micro-ultrasonic powder moulding of Sn–Bi/Cu composite micro parts in semisolid form

Luo, Wenyan; Wu, Xiaoyu; Wu, Sheng-Hai; Xu, Bin; Cheng, Rong; Ruan, Shuangchen

doi:10.1016/j.jmatprotec.2015.04.020

Cited by 5 publications

(2 citation statements)

References 14 publications

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“…Cheng et al [ 14 ] developed a microultrasonic powder molding method to directly form microparts, having the advantage of including a short forming cycle, low energy consumption, and low production costs. Similarly, Luo et al [ 15 ] used the microultrasonic powder molding process as a special semisolid forming method to fabricate semifinished microparts using 42Sn-58Bi eutectic alloy powder. The process effectively promoted the thermal performance and mechanical properties of the microparts.…”

Section: Introductionmentioning

confidence: 99%

“…Among these, microinjection molding, based on transferring a thermoplastic material in the form of granules from a hopper into a heated barrel, is one of the most popular polymer processing methods due to its high productivity; however, the energy consumption is, in general, too high. Manufacturing low-volume microparts for different applications, such as customized sensors in electronics or medical devices, is a challenge in Polymers 2023, 15, 3049 2 of 13 terms of dimensional accuracy. Some related problems, if tight tolerances are not achieved, are large amounts of parts being rejected, material wasted, and useless energy consumption.…”

Section: Introductionmentioning

confidence: 99%

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Polypropylene-Based Polymer Locking Ligation System Manufacturing by the Ultrasonic Micromolding Process

Elías-Grajeda,

Vázquez-Lepe,

Siller

et al. 2023

Polymers

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In recent years, there has been a growing demand for biocompatible medical devices on the microscale. However, the manufacturing of certain microfeatures has posed a significant challenge. To address this limitation, a new process called ultrasonic injection molding or ultrasonic molding (USM) has emerged as a potential solution. In this study, we focused on the production of a specific microdevice known as Hem-O-Lok, which is designed for ligation and tissue repair during laparoscopic surgery. Utilizing USM technology, we successfully manufactured the microdevice using a nonabsorbable biopolymer that offers the necessary flexibility for easy handling and use. To ensure high-quality microdevices, we extensively investigated various processing parameters such as vibration amplitude, temperature, and injection velocity. Through careful experimentation, we determined that the microdevice achieved optimal quality when manufactured under conditions of maximum vibrational amplitude and temperatures of 50 and 60 °C. This conclusion was supported by measurements of critical microfeatures. Additionally, our materials characterization efforts revealed the presence of a carbonyl (C=O) group resulting from the thermo-oxidation of air in the plasticizing chamber. This finding contributes to the enhanced thermal stability of the microdevices within a temperature range of 429–437 °C.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%