Microelectrical discharge machining of silicon wafers

Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining techniques are widely used to cut or pattern Si, in order to obtain high-quality surface finishes for the fabrication of devices. Micromachining techniques are used for the fabrication of three-dimensional (3D) microstructures for microelectromechanical devices. In this work, the capabilities and competencies of non-traditional Si micromachining techniques, including ultrasonic, ion beam milling, laser machining, and electrical discharge machining, are discussed and compared accordingly. The working principles, advantages, limitations, and Si microstructures that have been fabricated before are discussed in detail. Additionally, this work covers the performance reported by multiple researchers on these micromachining methods, spanning the temporal range of 1990 to 2020. The key outcomes of this study are explored and summarized.

show abstract

Non-traditional machining techniques for silicon wafers

Daud

Hasan

Saleh

et al. 2022

Int J Adv Manuf Technol

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Microelectrical discharge machining of silicon wafers

Cited by 1 publication

References 61 publications

Non-traditional machining techniques for silicon wafers

Non-traditional machining techniques for silicon wafers

Contact Info

Product

Resources

About