2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) 2021
DOI: 10.1109/eptc53413.2021.9663874
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Microelectronic Encapsulant Material Assessment: A Security Point of View

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Cited by 3 publications
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“…Regarding hardware assurance, the changes in material and structural properties due to aging can serve as unique identifiers or 'fingerprints' for the authentication of IC components. 6 Different fabrication processes, storage conditions, and usage histories induce distinct changes in EMC material properties. Consequently, these variations can be analyzed to distinguish authentic components from counterfeit ones.…”
Section: Introductionmentioning
confidence: 99%
“…Regarding hardware assurance, the changes in material and structural properties due to aging can serve as unique identifiers or 'fingerprints' for the authentication of IC components. 6 Different fabrication processes, storage conditions, and usage histories induce distinct changes in EMC material properties. Consequently, these variations can be analyzed to distinguish authentic components from counterfeit ones.…”
Section: Introductionmentioning
confidence: 99%