Microelectronics failure analysis using laser ablation of composite materials in system in package

Schwindenhammer, P.; Poirier, Patrick; Descamps, Philippe

doi:10.1109/eptc.2006.342807

Cited by 5 publications

(4 citation statements)

References 12 publications

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“…LASER has proved to be a very efficient technique to decapsulate ICs [1], [2]. The simplicity of the use, the precision of the decasulation area and the speed of the process to access the die and/or the bonding, made the LASER a widely used technique in lot of laboratories.…”

Section: State Of the Artmentioning

confidence: 99%

New decapsulation methods for ICs with Cu and Ag wires

Obein¹,

Berger

Poirier³

2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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Introduction of Cu and more recently of Ag wires in integrated circuits made the decapsulation more challenging for failure analysts. We made an experiment with the existing techniques we study in the past years and a comparison with the results and the emerging techniques from the last researchs. This study shows that solution has been demonstrated but there is still a place for improvement if we want to have a robust process for all types of ICs.

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Section: State Of the Artmentioning

confidence: 99%

New decapsulation methods for ICs with Cu and Ag wires

Obein¹,

Berger

Poirier³

2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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“…Although laser has advantages of accurate geometrical milling, rapid material removal rate, and selective ablation capability, un-optimized laser ablation process can cause irreversible physical damages to the device, such as fusion, marks, and oxidation. The main parameters that control laser ablation are power, frequency, and writing speed [2,3].…”

Section: Introductionmentioning

confidence: 99%

Case studies of laser ablation effects on Flash Memory devices

Seng¹,

Chai²,

Cheng³

et al. 2012

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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It becomes a trend of replacing Au wire bonds with Cu wire bonds in the plastic IC packages due to the benefit of cost saving and electrical performance. Some plastic packages, such as FGBA package used for Flash Memory devices, utilize a new type of epoxy mold compound with higher reliability. Such mold compound is harder against chemical etching than other mold compounds and poses a greater challenge for failure analysis. The conventional manual acid dripping and automated acid etching do not work for the packages with this "hard" mold compound. Laser ablation is a potential alternative to remove such mold compound for decapsulation purpose, but the process is not straight forward and it must be coupled with appropriate chemical treatment. To establish a working process, four different types of laser decapsulation tools available in the market are evaluated, and only one provides working solution for the decapsulation of this package. In this paper, the evaluation results of four laser decapsulation tools are presented. The best case study result (with optimized laser ablation parameters) compared with the worse case study result (with non-optimized laser ablation parameters) from the same laser tool will also be shared.

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“…With the continual shrinking of devices and the introduction of new materials such as copper bond wires [1], chemical, mechanical and plasma decapsulation [2] have nearly reached their limits. For instance, chemical decapsulation may damage the copper bond wires, the die or interconnections, since it is isotropic in nature [3,4].…”

Section: Introductionmentioning

confidence: 99%

“…Laser decapsulation is a promising failure analysis (FA) technique, which works with high speed and precision. Besides, it minimizes the effects of corrosion and overetching of leadframes [2][3][4]. Apart from being able to alleviate some of the problems of chemical, mechanical and plasma decapsulation, laser decapsulation is not constrained by geometry and it provides a good selectivity of plastic ablation over metals [5].…”

Section: Introductionmentioning

confidence: 99%