2001
DOI: 10.1088/0960-1317/11/6/312
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Microfabrication of channels using an embedded mask in negative resist

Abstract: A technique has been developed which allows the fabrication of channels within the body of multiple layers of negative resist. Previously this was only possible in the positive resist system but with the transfer to negative resist, higher and more clearly defined channels are now possible. Thick negative resists are also easier to process than their positive counterparts, allowing multiple crossing channels. The physical structure of a full height W-band waveguide with an integrated E-plane filter has been fa… Show more

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Cited by 39 publications
(26 citation statements)
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“…Since the top layer has much high lithographic sensitivity, it can be exposed with a much lower effective energy density. Therefore, the top layer's exposure will not significantly affect the pattered bottom layer without commonly employing an embedded metal mask to prevent underlying SU-8 from a second exposure (Alderman et al 2001;Guerin et al 1997). The 3D structure can be obtained with a single develop in PEMEA.…”
Section: Su-8r and Pag-diluted Su-8 As Sacrificial Layer Materialsmentioning
confidence: 99%
“…Since the top layer has much high lithographic sensitivity, it can be exposed with a much lower effective energy density. Therefore, the top layer's exposure will not significantly affect the pattered bottom layer without commonly employing an embedded metal mask to prevent underlying SU-8 from a second exposure (Alderman et al 2001;Guerin et al 1997). The 3D structure can be obtained with a single develop in PEMEA.…”
Section: Su-8r and Pag-diluted Su-8 As Sacrificial Layer Materialsmentioning
confidence: 99%
“…Many previous articles have used method with development of the channel after enclosure [27,[32][33][34][35]. Both SU-8 [27,[32][33][34][35] and other adhesives that are more easily dissolved [32] have been developed to open the channels.…”
Section: Microchip Fabricationmentioning
confidence: 99%
“…Both SU-8 [27,[32][33][34][35] and other adhesives that are more easily dissolved [32] have been developed to open the channels. These methods have an advantage of avoiding the blocking of the microchannel during enclosure that is the main source of failure in the "bonding after channel development" approach.…”
Section: Microchip Fabricationmentioning
confidence: 99%
“…Other microfabrication processes for polymers include photolithography, (Burns 1998;Harrison 2004;Haraldsson 2006;Lin 2002;Gadre 2004;Nijdam 2005;Liu et al 2003;Ribeiro et al 2005;Tay et al 2001;Lin et al 2002;Yu et al 2006;Metz et al 2004;Sato et al 2006;Agirregabiria et al 2005;Abgrall et al 2006;Yu et al 2006;Alderman et al 2001) casting, (McDonald et al 2000Whitesides et al 2001;Sia and Whitesides 2003;Gates et al 2005;Kumar and Whitesides 1993;Xia and Whitesides 1998;Kim et al 1996;Kim et al 1997) injection molding, (Giselbrecht et al 2006;McCormick et al 1997;Giboz et al 2007;Yu et al 2002;Hulme et al 2002;Svedberg et al 2003;Han et al 2003;Noerholm et al 2004;Ahn et al 2004;Xu et al 2005;Kim et al 2006;Mair et al 2006;Nikcevic et al 2007) microthermoforming, (Giselbrecht et al 2006), hot embossing (Armani and Liu 2000;Barker et al 2000;Becke...…”
Section: Introductionmentioning
confidence: 99%