Micromachined high frequency PMN-PT/Epoxy 1&amp;#x2013;3 composite ultrasonic annular arrays

Liu, Changgeng; Djuth, F. T.; Hu, Changhong; Chen, Ruimin; Zhang, Xiabing; Li, Xiang; Zhou, Qifa; Shung, K. Kirk

doi:10.1109/ultsym.2010.5936008

Cited by 5 publications

(7 citation statements)

References 12 publications

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“…The pins/needles are very uniform, with a height of 25 μm and a diameter of 20 μm. The fabrication process of the EIB has been explained in detail in [42]. …”

Section: Fabrication Of Ultrasonic Array Transducer Stackmentioning

confidence: 99%

“…Photolithography has been used to fabricate flexible circuits and pattern electrodes for array transducers. Similar microfabrication techniques involving chlorine-based plasma ion beams can be used to pattern bulk PMN-PT to form a composite [41], [42]. This is the technique that is adopted in the current study.…”

Section: Introductionmentioning

confidence: 99%

“…Electrical connection to each element is preferentially made on the back side of the transducer, which simplifies the top radiating surface. The most suitable choice for a high-frequency transducer is the direct attachment of the backing material [42] to the backside of the transducer. Electrical interconnection must reach the back electrode of the element through the backing material.…”

Section: Introductionmentioning

confidence: 99%

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Micromachining techniques in developing high-frequency piezoelectric composite ultrasonic array transducers

Liu

Djuth

Zhou

et al. 2013

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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Several micromachining techniques for the fabrication of high-frequency piezoelectric composite ultrasonic array transducers are described in this paper. A variety of different techniques are used in patterning the active piezoelectric material, attaching backing material to the transducer, and assembling an electronic interconnection board for transmission and reception from the array. To establish the feasibility of the process flow, a hybrid test ultrasound array transducer consisting of a 2-D array having an 8 × 8 element pattern and a 5-element annular array was designed, fabricated, and assessed. The arrays are designed for a center frequency of ~60 MHz. The 2-D array elements are 105 × 105 μm in size with 5-μm kerfs between elements. The annular array surrounds the square 2-D array and provides the option of transmitting from the annular array and receiving with the 2-D array. Each annular array element has an area of 0.71 mm2 with a 16-μm kerf between elements. The active piezoelectric material is (1 − x) Pb(Mg1/3Nb2/3)O3−xPbTiO3 (PMN-PT)/epoxy 1–3 composite with a PMN-PT pillar lateral dimension of 8 μm and an average gap width of ~4 μm, which was produced by deep reactive ion etching (DRIE) dry etching techniques. A novel electric interconnection strategy for high-density, small-size array elements was proposed. After assembly, the array transducer was tested and characterized. The capacitance, pulse–echo responses, and crosstalk were measured for each array element. The desired center frequency of ~60 MHz was achieved and the −6-dB bandwidth of the received signal was ~50%. At the center frequency, the crosstalk between adjacent 2-D array elements was about −33 dB. The techniques described herein can be used to build larger arrays containing smaller elements.

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“…The pins/needles are very uniform, with a height of 25 μm and a diameter of 20 μm. The fabrication process of the EIB has been explained in detail in [42]. …”

Section: Fabrication Of Ultrasonic Array Transducer Stackmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Micromachining techniques in developing high-frequency piezoelectric composite ultrasonic array transducers

Liu

Djuth

Zhou

et al. 2013

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

View full text Add to dashboard Cite

show abstract

“…In the practical application, since the diameter of the catheter in intravascular ultrasound (IVUS) system is considerably small (usually less than 1 mm), it is challenging to fabricate such miniaturized transducers with high center frequency using mechanical dicing and filling method [11][12][13][14]. Microelectromechanical systems (MEMS) techniques, on the other hand, give a new way such as photolithography or deep reactive techniques to fabricate such miniaturized devices [15].…”

Section: Introductionmentioning

confidence: 99%

“…According to the outstanding transducer performance, Ba 0.5 Na 0.5 TiO 3 (BNT)-based piezoelectric materials are good candidates for the IVUS applications [21]. Dan et al In this paper, lead-free BNT piezoelectric composite thick film has been employed to fabricate a kerfless linear array transducer being utilized in IVUS with MEMS, since dicing small kerfs is still complex process at present [12,13]. In the fabrication process, Si has been patterned by wet etching using KOH solution and etching speed has been explored.…”

Section: Introductionmentioning

confidence: 99%