Micromachined mid-infrared emitter for fast transient temperature operation for optical gas sensing systems

Abstract

A novel micromachined thermal emitter for fast transient temperature operation is presented. Most commercial available thermal emitters are not able to operate in a pulsed mode. The spider type hotplate concept promises an excellent mechanical stability together with high thermal decoupling. The thermal emitter is fabricated using silicon on insulator (SOI) technology and KOH-etching. The emitter is heated with a Pt-meander structure and the device is mounted in a TO-5 housing. Different suspensions structures as well as hotplate sizes were realized and mechanical and thermal characterizations were performed. Beside the possibility of pulsed operation, a high thermal emission at wavelengths >5 mum are achieved. Investigations on possible coatings for emissivity enhancement are the focus of the current work

Micromachined Hotplate Platform for the Investigation of Ink-Jet Printed, Functionalized Metal Oxide Nanoparticles

“…The exposed SiN layer is removed and Si is etched along the crystal orientation by anisotropic electrochemical wet etching with Potassium hydroxide (KOH) up until the buried Silicon dioxide (SiO 2 ) layer (Figure 4c/d). Finally, the suspended hotplates are obtained via structuring of the membranes using photolithography and RIE from the front-side (Figure 4e) [25]. Subsequently, the wafer is diced and mounted in a standard package.…”

CMOS compatible metal-insulator-metal plasmonic perfect absorbers

“…However, these good sensors remain bulky and expensive, thus making them unpractical for many applications such as the carbon dioxide (CO 2 ) detection targeted here. In order to overcome these limitations, a lot of work has been done recently toward low-cost, efficient infrared sources in the form of microhotplates in order to replace traditional blackbody filaments [2][3][4], since the source constrains the sensor design and its footprint.…”

Thermal Management Using MEMS Bimorph Cantilever Beams

“…However, this approach often requires additional components, such as a cooling fan, that increases system size, weight and power requirements. The need for these peripheral components can be eliminated by using alternative cooling techniques such as low temperature co-fired ceramic (LTCC) structures, electrowetting-on-dielectric (EWOD), liquid film cooling, variable thermal resistors ( V T R ) , m i c r o j e t s , m i c r o c h a n n e l c o o l e r s , a n d thermoacoustic-based cooling [1][2][3][4][5][6][7][8].…”