Micromechanics in optical microsystems - with focus on telecom systems

Bäcklund, Ylva

doi:10.1088/0960-1317/7/3/003

Cited by 12 publications

(8 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In addition, for multiwafer assemblies, when assembled one at a time, alternating curvatures have the potential to cause subsequently added wafers to be overstressed or deformed. Passive alignment has been used extensively for alignment of optical fibers in MOEMS [3]- [5], and has been used in setups for "rough" wafer-to-wafer alignment [6], and in MEMS packaging applications [7]. Capillary forces at the wafer-air interface between hydrophobic features patterned on wafers can align two wafers to each other to the micron level [8], but would be impractical for a stack of wafers.…”

Section: Introductionmentioning

confidence: 99%

Precision passive mechanical alignment of wafers

Slocum

Weber

2003

J. Microelectromech. Syst.

View full text Add to dashboard Cite

A passive mechanical wafer alignment technique, capable of micron and better alignment accuracy, was developed, fabricated and tested. This technique is based on the principle of elastic averaging: It uses mating pyramid (convex) and groove (concave) elements, which have been previously patterned on the wafers, to passively align wafers to each other as they are stacked. The concave and convex elements were micro machined on 4-in (100) silicon wafers using wet anisotropic (KOH) etching and deep reactive ion etching. Submicron repeatability and accuracy on the order of one micron were shown through testing. Repeatability and accuracy were also measured as a function of the number of engaged elements. Submicrometer repeatability was achieved with as little as eight mating elements. Potential applications of this technique are precision alignment for bonding of multiwafer MEMS devices and three-dimensional (3-D) interconnect integrated circuits (ICs), as well as one-step alignment for simultaneous bonding of multiple wafer stacks. Future work will focus on minimizing the size of the elements.

show abstract

Section: Introductionmentioning

confidence: 99%

Precision passive mechanical alignment of wafers

Slocum

Weber

2003

J. Microelectromech. Syst.

View full text Add to dashboard Cite

show abstract

“…In passive alignment, two or more components are located relative to each other by using mechanical structures without monitoring and feedback of the mismatch [8, 9]. Alignment accuracy depends primarily on the geometric accuracy of the structures.…”

Section: Introductionmentioning

confidence: 99%

“…Two prevailing alignment techniques, active and passive alignments, have been used to set components or devices in a desired relative location for the assembly or stacking of microsystems [7]. Active alignment continuously monitors the mismatch of parts during the assembly process so that the location of parts is fixed as the mismatch is minimised [8]. Mask alignment using machine vision systems for multilayer processing and silicon micromachining in UV-lithography are typical examples of active alignment [9].…”

mentioning

confidence: 99%

See 1 more Smart Citation

Method of mould alignment for double‐sided hot embossing of microfluidic devices using kinematic constraints

Conner¹,

Song²,

Park

et al. 2014

Micro & Nano Letters

View full text Add to dashboard Cite

Demand has increased for the double-sided moulding of microfluidic devices for a series of biochemical analyses. Accurate alignment of mould inserts is a critical aspect to transfer doubled-sided patterns on the top and bottom surfaces of a moulded part. A method of mould alignment was studied for double-sided hot embossing of polymer microfluidic devices. An alignment method was designed using kinematic constraints, and a set of three locating pins. To validate the alignment method, two brass mould inserts with fluidic reservoirs were used for the double-sided moulding of prototype microfluidic devices. The kinematic constraints were used to align the mould inserts with each other on the hot embossing machine. The misalignment of double-sided features on the moulded parts was measured using a measuring microscope. The X-and Y-magnitudes of the mismatches ranged from −28 to 118 µm along the X-axis of the moulded parts. The X-and Y-magnitudes of the mismatches along the Y-axis of the moulded parts varied from −38 to 141 µm. The results of the experiments showed that the mould alignment using kinematic constraints is applicable to the fabrication of double-sided patterns for microfluidic devices.

show abstract

“…In the future optical waveguides for short distances of approximately 1-2 inches are a promising alternative to electrical carrier because of a comparably high transmission rate, a low heat generation and an insensibility to electromagnetic perturbation. The use of planar optical waveguides is also an alternative method to the fibres technique for several reasons [2]. Especially polymeric planar optical waveguides generated with UV-laser radiation offer advantages compared to conventional techniques.…”

Section: Introductionmentioning

confidence: 99%

<title>Debris-reduced laser machining of polymeric waveguides for optoelectronic applications</title>

2001

View full text Add to dashboard Cite

A polymer multilayer was spin coated on a substrate and was structured with pulsed KrF-excimer laser radiation to generate optical waveguides. Ablation rate, surface roughness and wall-angles were determined using white light interferometry, atomic force microscopy and light microscopy. Polymeric waveguides can be used for optical transmission and their properties such as mode propagation and absorption losses were determined with beam diagnosis. However, compared to other structuring techniques absorption losses of the waveguides are high. One reason for this is the formation of debris on the surface of the waveguides during the process of structuring. Therefore, an investigation of the distribution of debris during structuring was conducted. Different types of processing gases and pressures were used to decide which configuration provides a minimum amount of debris. Absorption losses were again determined and successfully decreased after debris reducing strategies were applied.

show abstract

Micromechanics in optical microsystems - with focus on telecom systems

Cited by 12 publications

References 10 publications

Precision passive mechanical alignment of wafers

Precision passive mechanical alignment of wafers

Method of mould alignment for double‐sided hot embossing of microfluidic devices using kinematic constraints

<title>Debris-reduced laser machining of polymeric waveguides for optoelectronic applications</title>

Contact Info

Product

Resources

About