Micromoulding of PZT film structures using electrohydrodynamic atomization mould filling

Wang, D.; Rocks, Sophie A.; Dorey, Robert

doi:10.1016/j.jeurceramsoc.2008.08.018

Cited by 10 publications

(10 citation statements)

References 29 publications

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“…22 While, it can be concluded that the drying temperature during the EHDA deposition process has no distinct effect on the electrical properties of the structures it does, however, lead to better shape control. The P r and ε r are still lower than the bulk PZT materials, which is mainly due to the existence of pores in the films and presence of the rigid substrate constraining the film.…”

Section: Electrical Characterisationmentioning

confidence: 99%

“…22 Fig . 2 shows the sintered patterned PZT structures consisting of rectangles and squares of different sizes and separations obtained after depositing 50 EHDA layers and the removal of the nickel micromoulds.…”

Section: Feature Of Pzt Structuresmentioning

confidence: 99%

“…The features exhibit more regular features compared with those produced from polymeric moulds. 22 Fig. 3 presents the surface microstructure of the patterned PZT film structure after sintering, which exhibits a well-packed and crack-free film.…”

Section: Feature Of Pzt Structuresmentioning

confidence: 99%

“…21 The EHDA technique has also been employed in the micromoulding process to form PZT thick film structures by depositing dense and crack free PZT films from a PZT composite sol-gel slurry into polymeric moulds. 22 This delivers a higher resolution over chemical wet etching and screen printing techniques, avoids the use of hazardous solutions such as hydrofluoric acid used in chemical wet etching, and the high temperature (850-1200 • C) employed in sintering screen printed structures. However, the polymeric micromould material (AZ9260) used in our previous work is intolerant to high temperatures where temperatures higher than 110 • C resulted in its rapid deformation and degradation, leading to irregular PZT features.…”

Section: Introductionmentioning

confidence: 99%

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Formation of PZT micro-scale structures using electrohydrodynamic atomization filling of metallic moulds

Wang

Rocks

Dorey

2010

Journal of the European Ceramic Society

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Section: Electrical Characterisationmentioning

confidence: 99%

Section: Feature Of Pzt Structuresmentioning

confidence: 99%

Section: Feature Of Pzt Structuresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Formation of PZT micro-scale structures using electrohydrodynamic atomization filling of metallic moulds

Wang

Rocks

Dorey

2010

Journal of the European Ceramic Society

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“…and Guillon et al . A major issue for constrained sintering is how to avoid cracking . During sintering, the shrinkage of a film is constrained by the substrate, giving rise to stresses which may lead to cracking.…”

Section: Introductionmentioning

confidence: 99%

Defect Healing and Cracking in Ceramic Films During Constrained Sintering

Pan

Cocks

2012

J. Am. Ceram. Soc.

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Cracking is a major problem during constrained sintering of ceramic films. A local variation of density in a green film, referred to as a defect in this work, is the leading cause for cracking. This article presents analytical and numerical studies of the behavior of such defects during constrained sintering. An interesting behavior of de-sintering and healing of the defects is revealed. It is demonstrated that the healing process can be made to start earlier during sintering by using (a) larger particles, (b) lower sintering temperature, and (c) lower initial density. However, a uniform distribution of initial density in the film is shown to be the most effective means to avoid cracking. It is realized that most of the factors beneficial to defect healing are detrimental to sintering a film to high density because the driving force for sintering also drives cracking. The analytical and numerical studies also offer some simple explanations to why thin films are less susceptible to cracking than thick ones. Finally, the constitutive model has been combined with a simple empirical failure criterion, to simulate the initiation and propagation of multiple cracks in a sintering film. The cracking patterns predicted by the simulations resemble those observed during sintering experiments.

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Dorey¹

2012

Ceramic Thick Films for MEMS and Microdevices

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Micromoulding of PZT film structures using electrohydrodynamic atomization mould filling

Cited by 10 publications

References 29 publications

Formation of PZT micro-scale structures using electrohydrodynamic atomization filling of metallic moulds

Formation of PZT micro-scale structures using electrohydrodynamic atomization filling of metallic moulds

Defect Healing and Cracking in Ceramic Films During Constrained Sintering

Houston, we have a problem

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