2020
DOI: 10.1109/jmems.2020.2983717
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Micropatterning and Integration of Electrospun PVDF Membrane Into Microdevice

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Cited by 6 publications
(4 citation statements)
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“…Besides, special treatment including electrospinning (Li et al, 2008), solventcasting (Hu et al, 2015), mechanical stretching, and polarization under high electric fields (Fukada and Sakurai., 1971;Cheng-Lu et al, 2014) of PVDF (Sencadas et al, 2009;Sharma et al, 2013;Won et al, 2016) have been employed. According to the research report on the electrospinning process of the high β-phase PVDF membrane, the micro-patterned device as an energy harvester can generate an open circuit voltage density of 1.42 V m −2 (Fadzallah et al, 2020). However, the electrospinning and solvent-casting usually induce some undesired structure deformation or microstructure defeats.…”
Section: Introductionmentioning
confidence: 99%
“…Besides, special treatment including electrospinning (Li et al, 2008), solventcasting (Hu et al, 2015), mechanical stretching, and polarization under high electric fields (Fukada and Sakurai., 1971;Cheng-Lu et al, 2014) of PVDF (Sencadas et al, 2009;Sharma et al, 2013;Won et al, 2016) have been employed. According to the research report on the electrospinning process of the high β-phase PVDF membrane, the micro-patterned device as an energy harvester can generate an open circuit voltage density of 1.42 V m −2 (Fadzallah et al, 2020). However, the electrospinning and solvent-casting usually induce some undesired structure deformation or microstructure defeats.…”
Section: Introductionmentioning
confidence: 99%
“…[1] Recent advances in piezo-polymer processing have enabled the development of such components for high-end electronics systems/subsystems and on flexible and/or transparent substrates. [2][3][4][5] This simply requires a highly responsive piezo-polymer material which favors in maximizing the figure of merit (FOM = mechanical to electrical conversion).…”
Section: Introductionmentioning
confidence: 99%
“…However, these techniques often require high sintering temperatures (>1000 °C), complex and time-consuming processing conditions, and hazardous materials. For example, patterning of poly(vinylidene fluoride) (PVDF) films needs the combination of spin coating and reactive ion etching 18 , 19 or micromold-assisted process 20 (soft lithography). For inorganic piezoelectric ceramics, the above patterning techniques lack compatibility with flexible and stretchable substrates.…”
Section: Introductionmentioning
confidence: 99%