Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

“…Interconnection technologies using anisotropic conductive films (ACFs) are major packaging methods for flat panel display modules to be high resolution, light weight, thin profile and low consumption power [1], which are already successfully implemented in the forms of Out Lead Bonding (OLB), flex to PCB bonding (PCB), reliable direct chip attach such as Chip-On-Glass (COG), Chip-On-Film (COF) for LCD modules [2][3][4]. As for the small and fine pitched bump of driver ICs to be packaged, fine pitch capability of ACF interconnection is much more desired especially for COG.…”

Mechanical properties of anisotropic conductive film with strain rate and temperature

“…The parameters (m) and (m) are found by fitting experimental data in relaxation tests at different temperatures, and Fig. 10 shows that the parameter (1) , (1) and (2) are practically independent of temperature while the parameter (2) changes with temperature rather weakly. The given function˚(ε) can be obtained by the power-law approximation Eq.…”

“…Over the past decades ACF has been widely and successfully implemented in packaging technologies for flat panel displays (FPD), such as liquid crystal displays (LCD), and for flip chip, such as chip-on-glass (COG) attachments, and chip-on-film (COF) attachments [2][3][4]. Generally, ACF joint technology has a number of advantages which include: (1) fine pitch capability; (2) low-temperature processing capability (resulting in reduced thermal stress during processing); (3) lowcost flexible processing; (4) avoidance of lead or other toxic metals; (5) compatibility with a wide range of surfaces [5].…”

Resin Core Bump Technology for Highly Reliable 20.MU.m Pitch Chip on Glass Interconnections

“…The reliability of the interconnection is maintained by the balance of the shrinking force of ACF binders and the elastic force of compressed conductive particles. [2] Today high-definition LCD panels are required, especially for mobile electronics applications. However, when we create fine pitch interconnections with conventional COG structures, we risk increasing electrical short circuit failures caused by the agglomeration of conductive particles between adjoining gold bumps.…”