“…In STM on a semiconductor, a nanoscale metal-insulator-semiconductor (MIS) junction is formed by the STM tip, tunneling gap, and sample. Thus, when a reverse bias voltage is applied to the junction, tip-induced band bending (TIBB) occurs in the surface region owing to the leakage of the electric field into the sample [9,18,21]. With optical illumination, the redistribution of photocarriers reduces the electric field and changes the surface potential, which is called SPV, and increases the effective bias voltage applied to the tunnel junction.…”