Microscopic characterization and interfacial properties of the Ag/CuO interface: Structure and binding properties of the interface based on first-principles calculations

Yuan, Chenhe; Li, Jintao; Zhou, Xiaolong

doi:10.1016/j.matchemphys.2024.128952

Cited by 6 publications

(1 citation statement)

References 34 publications

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“…Ag-based electrical contact materials such as AgMeO [ 1 ], AgNi [ 2 ], AgC [ 3 ], AgWC [ 4 ] and AgZrB 2 [ 5 ] are presently among the most widely employed options in the field. Various AgMeO electrical contact materials, including AgCdO [ 6 ], AgSnO 2 [ 7 ], AgZnO [ 8 ], AgZnO 2 [ 9 ], AgCuO [ 10 ], AgY 2 O 3 [ 11 ] and Ag(MgCoNiCuZn)O [ 12 ] have been developed due to their exceptional electrical contact properties, improved resistance to welding and arc erosion, as well as enhanced thermal and electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Shao,

Zhang,

et al. 2024

Materials

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Ag-Sn-In-Ni-Te alloy ingots were produced through a heating–cooling combined mold continuous casting technique; they were then drawn into wires. However, during the drawing process, the alloy wires tended to harden, making further diameter reduction challenging. To overcome this, heat treatment was necessary to soften the previously drawn wires. The study investigated how variations in heat treatment temperature and holding time affected the microstructure, microhardness and corrosion resistance of the alloy wires. The results indicate that the alloy wires subjected to heat treatment at 700 °C for 2 h not only exhibited a uniform microstructure distribution, but also demonstrated low microhardness and excellent corrosion resistance.

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Section: Introductionmentioning

confidence: 99%

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Shao,

Zhang,

et al. 2024

Materials

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Adhesion, Stability and Electronic Properties of Ag/SnO₂ Interface from First‐Principles Calculation

Xu,

Li,

Teng

et al. 2024

Cryst. Res. Technol.

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The interfacial bonding state between each oxide and the silver matrix in AgCuOIn2O3SnO2 electrical contact materials remains unclear. To address this, first‐principles calculations using density‐functional theory are employed to establish the low‐index surfaces of Ag and SnO2 and perform convergence tests. Computational results reveal that the Ag (111) surface and the SnO2(110)‐O surface exhibit the highest stability among their respective low‐index surfaces. Consequently, these surfaces are chosen to form the interfacial model, and their atomic structure, adhesion work, and interfacial energies are systematically analyzed. The results demonstrate that the stability and interfacial bonding strength of the Ag(111)/SnO2(110)‐O interface are high, exhibiting metallic properties and strong conductivity. Moreover, at an interface spacing of d0 = 2.4 Å, the interface stability is optimal. The redistribution of charge at the interface induces significant changes in the local atomic density of states, particularly noticeable in the Ag and O atoms. Additionally, the Ag/SnO2 interface is predominantly bonded through ionic interactions, contributing to its robust bonding.

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Photocatalytic and Antibacterial Activities of Alternanthera dentata Mediated Bio-nanocomposite of CuO Nanoparticles and DFT Study on the Selective Capping Behavior of Phytocompounds

Deka,

Kalita,

Sarma

et al. 2024

J. Electron. Mater.

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Microscopic characterization and interfacial properties of the Ag/CuO interface: Structure and binding properties of the interface based on first-principles calculations

Cited by 6 publications

References 34 publications

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Adhesion, Stability and Electronic Properties of Ag/SnO₂ Interface from First‐Principles Calculation

Photocatalytic and Antibacterial Activities of Alternanthera dentata Mediated Bio-nanocomposite of CuO Nanoparticles and DFT Study on the Selective Capping Behavior of Phytocompounds

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Microscopic characterization and interfacial properties of the Ag/CuO interface: Structure and binding properties of the interface based on first-principles calculations

Cited by 6 publications

References 34 publications

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Influence of Heat Treatment Condition on the Microstructure, Microhardness and Corrosion Resistance of Ag-Sn-In-Ni-Te Alloy Wire

Adhesion, Stability and Electronic Properties of Ag/SnO2 Interface from First‐Principles Calculation

Photocatalytic and Antibacterial Activities of Alternanthera dentata Mediated Bio-nanocomposite of CuO Nanoparticles and DFT Study on the Selective Capping Behavior of Phytocompounds

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Product

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Adhesion, Stability and Electronic Properties of Ag/SnO₂ Interface from First‐Principles Calculation