Microstructural and Hardness Evaluations of a Centrifuged Sn-22Pb Casting Alloy Compared with a Lead-Free SnAg Alloy

Satizabal, Luz M.; Costa, Diego; Hainick, Guilherme Ottamr; Moura, Diego Rodrigo; Bortolozo, Ausdinir D.; Osório, Wislei R.

doi:10.1007/s11661-016-3945-1

Cited by 8 publications

(2 citation statements)

References 24 publications

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“…A number of experimental investigations [38][39][40][41][42][43][44] considering distinctive materials and alloys has reported that the increase of the imposed cooling rate generates an increase in the mechanical behavior. Based on the experimental results and comparing with commercial brasses, evaluations between examined brasses and those commercial brasses can be carried out.…”

Section: Hardness Microstructure Array and Cooling Rate Correlationsmentioning

confidence: 99%

Designing a Microstructural Array Associated with Hardness of Dual-phase Cu-Zn Alloy Using Investment Casting

et al. 2018

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A comparative investigation on the microstructural morphologies and hardness values of Cu-35 wt.% Zn and Cu-30 wt.% Zn with 1.5 wt.% Al content is provided. Distinctive specimens by using traditional investment casting were produced. Specimens withdrawn from distinct locations along the castings were thermally and microstructural analyzed. Thermally and chemically induced microstructural modifications affecting the microstructure and hardness are discussed. It is found that components (specimens) located at different positions along of the pattern tree casting have distinctive hardness values. This is associated with Cu segregation and cooling rate. It is also found that solidified piece under a cooling rate ~0.12 K/s has hardness 20% higher than the specimen solidified under 0.07 K/s. Duplex brass with Widmanstätten structure constitutes the resulting microstructure array. This seems to be associated with Al content, while both Zn and Al contents are associated with cooling rate as responsible parameter to induce Widmanstätten structure formation.

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Section: Hardness Microstructure Array and Cooling Rate Correlationsmentioning

confidence: 99%

Designing a Microstructural Array Associated with Hardness of Dual-phase Cu-Zn Alloy Using Investment Casting

et al. 2018

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“…mechanical, corrosion and wettability), including their corresponding IMC formation when this is clearly constituted. [25][26][27][28][29] The formation of aluminum dendrites is based on the dissolution of aluminum grains, which are dissolved from their centers by the surrounding Sn solder. 24 On the other hand, the addition of Ag 23,30 and In 30,31 to SnZn alloys improves mechanical and wetting properties.…”

Section: Introductionmentioning

confidence: 99%

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Gancarz

Bobrowski

Pawlak

et al. 2017

Journal of Elec Materi

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Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in the presence of ALU33 Ò flux. Spreading tests were performed for 60 s, 180 s, and 480 s of contact, at temperatures of 503 K, 523 K and 553 K (230°C, 250°C, and 280°C). After cleaning the flux residue from solidified samples, the spreading areas of Sn-Zn0.5Ga and Sn-Zn0.2Na on Al and Ni substrate were determined. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy, x-ray diffraction study and synchrotron measurements of the interfacial microstructure and identification of the phases. The growth of the intermetallic Ni 5 Zn 21 phase layer was studied at the solder/Ni substrate interface, and the kinetics of the formation and growth of the intermetallic layer were determined. The formation of interlayers was not observed on the Al pads. On the contrary, dissolution of the Al substrate and migration of Alrich particles into the bulk of the solder were observed.

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Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering

Mao

Zhang

et al. 2021

J Mater Sci: Mater Electron

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Microstructural and Hardness Evaluations of a Centrifuged Sn-22Pb Casting Alloy Compared with a Lead-Free SnAg Alloy

Cited by 8 publications

References 24 publications

Designing a Microstructural Array Associated with Hardness of Dual-phase Cu-Zn Alloy Using Investment Casting

Designing a Microstructural Array Associated with Hardness of Dual-phase Cu-Zn Alloy Using Investment Casting

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering

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