TOMASZ GANCARZ, JANUSZ PSTRUS´, SYLWIA MOSIŃ SKA, and SYLWIA PAWLAK The thermal properties, electrical resistivity, thermal linear expansion and tensile strength of a new high-temperature lead-free solder based on a eutectic Zn-Al alloy with 0.5, 1.0, or 1.5 at. pct Cu added were studied. Wettability studies on Cu substrate were performed with flux at 773 K (500°C) for 60, 180, 240, 900, 1800, and 3600 seconds, and for 480 seconds at 733 K, 753 K, 773 K, 793 K, and 823 K (460°C, 480°C, 500°C, 520°C, and 550°C, respectively). The experiment was designed to demonstrate the effect of the addition of Cu on the kinetics of the formation and growth of the CuZn, Cu 5 Zn 8 , CuZn 4 , and Al 4 Cu 9 phases, which were identified by X-ray diffraction analysis. Wetting tests were also performed on the Al substrate, for 15 and 30 seconds at 773 K and 793 K (500°C and 520°C, respectively). Very low contact angles on Al pads were obtained. The electrical resistivity of Zn-Al-Cu alloys was slightly higher than that of the ZnAl eutectic alloy. The present results are discussed with respect to the available literature on Zn-Al and Zn-Al-Cu alloys.

Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in the presence of ALU33 Ò flux. Spreading tests were performed for 60 s, 180 s, and 480 s of contact, at temperatures of 503 K, 523 K and 553 K (230°C, 250°C, and 280°C). After cleaning the flux residue from solidified samples, the spreading areas of Sn-Zn0.5Ga and Sn-Zn0.2Na on Al and Ni substrate were determined. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy, x-ray diffraction study and synchrotron measurements of the interfacial microstructure and identification of the phases. The growth of the intermetallic Ni 5 Zn 21 phase layer was studied at the solder/Ni substrate interface, and the kinetics of the formation and growth of the intermetallic layer were determined. The formation of interlayers was not observed on the Al pads. On the contrary, dissolution of the Al substrate and migration of Alrich particles into the bulk of the solder were observed.

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Kynurenic acid (KYN; systematic name: 4‐hydroxyquinoline‐2‐carboxylic acid, C10H7NO3) displays a therapeutic effect in the treatment of some neurological diseases and is used as a broad‐spectrum neuroprotective agent. However, it is understudied with respect to its solid‐state chemistry and only one crystal form (α‐KYN·H2O) has been reported up to now. Therefore, an attempt to synthesize alternative solid‐state forms of KYN was undertaken and six new species were obtained: five solvates and one salt. One of them is a new polymorph, β‐KYN·H2O, of the already known KYN monohydrate. All crystal species were further studied by single‐crystal and powder X‐ray diffraction, thermal and spectroscopic methods. In addition to the above methods, differential scanning calorimetry (DSC), in‐situ variable‐temperature powder X‐ray diffraction and Raman microscopy were applied to characterize the phase behaviour of the new forms. All the compounds display a zwitterionic form of KYN and two different enol–keto tautomers are observed depending on the crystallization solvent used.