Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

Gancarz, Tomasz; Bobrowski, Piotr; Pstruś, J.; Pawlak, Sylwia

doi:10.1016/j.jallcom.2016.04.040

Cited by 11 publications

(10 citation statements)

References 45 publications

(51 reference statements)

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“…21 The addition of 0.2 (wt.%) Na to Sn-Zn caused the formation of NaZn 13 and Na-Sn precipitates, which led to improved mechanical properties of the solder and a slight reduction in the IMC layer at the interface. 22 In the case of soldering on Ni substrate, with Sn-Zn containing Ga and Na, similar behavior is expected. However, the level of Zn in Sn-Zn alloys caused the formation of ternary IMCs from Sn-ZnNi, as shown in Ref.…”

Section: Introductionsupporting

confidence: 57%

“…2 Taking into account that Zn has a strong chemical affinity with Cu, the amount of soluble Zn content in the solder should be reduced. [18][19][20] Similar behavior for Sn-Zn with Ga and Na 22 on Cu substrate was observed. The addition of 0.5 (wt.%) Ga to eutectic Sn-Zn caused a reduction in the IMC layer at the interface.…”

Section: Introductionmentioning

confidence: 58%

“…1b), which was not observed during heating because the small amount of IMC dissolved over time and the effect was blurred on the curve. However, this thermal effect (peak) only occurred during heating for higher Na content, 22 as a result of the formation of more IMCs. The 0.5Ga and 0.2Na additions to eutectic Sn-Zn were selected because they yielded the highest value of spreading area on Cu substrate.…”

Section: Resultsmentioning

confidence: 97%

“…The thicknesses of the IMC layers on the Ni substrate were determined in the same place, and the average value was calculated from the schedule of 12 measurements for all microstructures. 22 The greatest differences were less than 3%. To determine the diffusion coefficient described in Refs.…”

Section: Methodsmentioning

confidence: 91%

“…The alloys had been characterized in previous studies. 3,22,32 For soldering, the as-cast solders were cut into pieces of $0.2 g each, and Al and Ni substrates (25 9 20 9 0.25 mm) without special treatment were used. The tests were carried out with the setup used in studies of Sn-Zn, 8 which enables the quick transfer of the sample to the already heated furnace, and out of it after the designated time, so that both the heating rate and cooling rate are high.…”

Section: Methodsmentioning

confidence: 99%

See 4 more Smart Citations

Wetting of Sn-Zn-Ga and Sn-Zn-Na Alloys on Al and Ni Substrate

Gancarz

Bobrowski

Pawlak

et al. 2017

Journal of Elec Materi

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Wetting of Al and Ni substrate by Sn-Zn eutectic-based alloys with 0.5 (wt.%) of Ga and 0.2 (wt.%) of Na was studied using the sessile drop method in the presence of ALU33 Ò flux. Spreading tests were performed for 60 s, 180 s, and 480 s of contact, at temperatures of 503 K, 523 K and 553 K (230°C, 250°C, and 280°C). After cleaning the flux residue from solidified samples, the spreading areas of Sn-Zn0.5Ga and Sn-Zn0.2Na on Al and Ni substrate were determined. Selected, solidified solder-pad couples were cross-sectioned and subjected to scanning electron microscopy with energy dispersive spectroscopy, x-ray diffraction study and synchrotron measurements of the interfacial microstructure and identification of the phases. The growth of the intermetallic Ni 5 Zn 21 phase layer was studied at the solder/Ni substrate interface, and the kinetics of the formation and growth of the intermetallic layer were determined. The formation of interlayers was not observed on the Al pads. On the contrary, dissolution of the Al substrate and migration of Alrich particles into the bulk of the solder were observed.

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Section: Introductionsupporting

confidence: 57%