2015
DOI: 10.1016/j.intermet.2015.06.019
|View full text |Cite
|
Sign up to set email alerts
|

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Abstract: Citation: MO, L. et al., 2015 Meanwhile, some equiaxial ultra-fine grains accompanied with the Kirkendall voids, were found only in adjacent to the electroplated copper. In addition, a specific type of micropillar with the size ~5μm×5μm×12μm fabricated by focus ion beam (FIB) was used to carry out the mechanical testing by Nano-indentation, which confirmed that this type of joint is mechanically robust, regardless of its porous Cu 3 Sn IMC interconnection.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

1
7
0

Year Published

2016
2016
2024
2024

Publication Types

Select...
7
2

Relationship

0
9

Authors

Journals

citations
Cited by 49 publications
(8 citation statements)
references
References 34 publications
1
7
0
Order By: Relevance
“…The higher Cu concentrations and lower Sn concentrations observed below the electroless Ni-P plating layer as compared with those of the surroundings indicate the formation of Cu-Sn-based intermetallic compounds. Our FE-EPMA observations of the bonding interface of the p-type thermoelectric modules are consistent with previous studies, which concluded that Cu-Sn-based intermetallic compounds exist in the form of Cu 3 Sn and Cu 6 Sn 5 [23][24][25][26], and that they prevent interdiffusion between the Ni-P plating layer and Sn.…”
Section: Resultssupporting
confidence: 92%
See 1 more Smart Citation
“…The higher Cu concentrations and lower Sn concentrations observed below the electroless Ni-P plating layer as compared with those of the surroundings indicate the formation of Cu-Sn-based intermetallic compounds. Our FE-EPMA observations of the bonding interface of the p-type thermoelectric modules are consistent with previous studies, which concluded that Cu-Sn-based intermetallic compounds exist in the form of Cu 3 Sn and Cu 6 Sn 5 [23][24][25][26], and that they prevent interdiffusion between the Ni-P plating layer and Sn.…”
Section: Resultssupporting
confidence: 92%
“…This shows that the wettability of the surface of the electroless Ni-P plating layer with the solder was better than that of the surface of the thermoelectric element alone. This is because Ni has a higher diffusion rate to the form of Cu3Sn and Cu6Sn5 [23][24][25][26], and that they prevent interdiffusion between the Ni-P plating layer and Sn. A Sn-Ag-Cu solder ball with a diameter of 0.76 mm was melted at 260 °C for 6 min and the cross-sectional view is shown in Figure 6.…”
Section: Resultsmentioning
confidence: 99%
“…Interestingly, the submicron voids were observed in the Cu 3 Sn layer on the Cu particles, but not on the Cu substrate, as shown in Figures 6, 9 and 10 in Section 3. Some studies demonstrated that submicron voids could be formed because of Kirkendall voids within the TLP layers of Cu-Sn [23,33,34], Ni-Sn [35], and Ag-Sn [23] systems. The Kirkendall voids were also observed in joints consisting of Sn-based solders and Cu [15,[36][37][38].…”
Section: Discussionmentioning
confidence: 99%
“…This can explain why the Cu/Sn/Cu structures take a long time or a high temperature to form full Cu 3 Sn compound joints. The microstructure evolution of Cu/Sn/Cu structure is schematically shown in Figure 7(a)-(c) (Li et al, 2011;Mo et al, 2015). In this paper, the composite joint was made of microporous copper filled with Sn as filling layer.…”
Section: Figure 1 Schematic Of the Thermo-compression Bonding Processmentioning
confidence: 99%