Microstructural and segregation effects affecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution

Septimio, Rudimylla da Silva; Cruz, Clarissa; Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé

doi:10.1007/s10800-021-01533-5

Cited by 3 publications

(1 citation statement)

References 40 publications

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“…The opposite case consists of designing a suitable alloy that must resist higher application temperatures in the part [ 19 ]. The solders suitable for higher application temperatures should possess a melting point in the approximate range from 260 °C to 420 °C [ 20 ]. For this purpose, the Sn-Sb-Ti solder was applied for soldering the combination of SiC/Ni joints.…”

Section: Introductionmentioning

confidence: 99%

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

et al. 2022

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The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 °C. The solder consists of a tin matrix where the Ti6(Sb,Sn)5 and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33° was obtained in a vacuum at the temperature of 950 °C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi2 and Ti3Ni5Si6 phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni3Sn2 and Ni3Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 °C.

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Section: Introductionmentioning

confidence: 99%

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

et al. 2022

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Inconel 625 Coating Produced by Directed Energy Deposition–Laser Beam (DED-LB) for Corrosion-Resistant Applications

Mariani,

Konno,

Cruz

et al. 2024

J. of Materi Eng and Perform

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Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder

et al. 2023

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<abstract> The aim of this research was to study the interaction and solderability of Al2O3 ceramics and Ni-SiC composite by use of an active solder type Bi11Ag1.5Ti1Mg. The chemical composition of the solder is 86.5 wt% Bi, 11 wt% Ag, 1.5 wt% Ti, 1 wt% Mg. Soldering was performed by ultrasonic activation. This solder has a wide melting interval with the initial melting temperature of 263 ℃, what corresponds to the eutectic reaction. The liquidus temperature of this solder was determined at 437 ℃. The bond between the ceramic and the solder is formed by the interaction of the active metals Bi, Ag and Mg with the surface of the substrate Al2O3. The thickness of the Mg reaction layer at the interface was approximately 0.8 μm. The bond at the interface between Ni-SiC and solder was formed due to the interaction of the active metals Bi, Ag, Mg and Ti. Feasibility of Bi11Ag1.5Ti1Mg solder was assessed on the basis of analyses of joint boundaries and joint shear strength measurements. The average shear strength of Al2O3/Bi11Ag1.5Ti1Mg/Ni-SiC joint was 54 MPa. </abstract>

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Microstructural and segregation effects affecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution

Cited by 3 publications

References 40 publications

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Inconel 625 Coating Produced by Directed Energy Deposition–Laser Beam (DED-LB) for Corrosion-Resistant Applications

Ultrasonic soldering of Al<sub>2</sub>O<sub>3</sub> ceramics and Ni-SiC composite by use of Bi-based active solder

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