Microstructural characterization and mechanical properties of nitrided layers on aluminum substrate prepared by nitrogen arc

Zheng, Xiaohui; Ren, Zhenan; Li, Xin; Wang, Yanan

doi:10.1016/j.apsusc.2012.07.075

Cited by 12 publications

(20 citation statements)

References 23 publications

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“…The hardness was reduced and the weightlessness of wear of the nitrided layer increased. It is in good agreement with the results of [18] nitrogen-containing thermal plasma aluminium nitride matrix. When the proportion of nitrogen exceeded 40 %, the amount of Al solid solution in the nitride layer increased, the weight loss and average friction coefficient of the nitride layer gradually increased, and wear resistance decreased.…”

Section: The Microhardness and Wear Resistance Of The Nitrided Layersupporting

confidence: 89%

“…From the typical structure test of the Ti powder-assisted nitrided layer it was found that the average microhardness was 77 HV0.1 for Al solid solution, 589 HV0.1 for the dense distribution area of AlN, 692 HV0.1 for the dense distribution area of Al3Ti, and 1025 HV0.1 for the dense distribution area of yellow TiN. The last was obviously higher than the maximum hardness of the surface nitrided layer of aluminum matrix without Ti powders in the literature (690 HV0.1) [18], the nitride layer in this paper contains Al3Ti and TiN phases, which have a higher microhardness, therefore, the microhardness of the nitride layer is increased.…”

Section: The Microhardness and Wear Resistance Of The Nitrided Layermentioning

confidence: 80%

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The Microstructure and Wear Resistance of the Ti-assisted Hot Plasma Nitrided Layer

Huang¹,

Ren²,

Lu³

et al. 2019

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In order to improve the wear resistance of the surface nitrided layer of 1060 aluminum matrix, the nitrogen containing thermal plasma Ti-assisted nitriding method was adopted to obtain the strengthening phases of AlN and TiN simultaneously. The influence of the nitriding technological parameter on Ti-assisted nitriding was studied through changing the nitrogen containing thermal plasma current (I = 100 to 160 A) and the flow ratio of the nitriding atmosphere (Ar/N2 = 8/2, 6/4, 4/6 and 2/8 L/min). The nitrided layer prepared under the Ti-assisted nitriding conditions was composed of AlN and Al solid solution, Al3Ti and TiN phases. The average microhardness of TiN dense distribution area was 1025 HV0.1, significantly higher than that of AlN dense distribution area (589 HV0.1). When the proportion of nitrogen in the plasma gas was 40% and the current was 120 A, the weight loss of the nitrided layer after wear was 3.4 mg, and its average friction coefficient was 0.214. Compared with those of aluminum matrix, the friction coefficient of the surface nitrided layer reduced by 33 %, and the wear resistance capacity increased by 4.5 times. Ti-assisted nitriding could obtain the AlN and TiN compound strengthening effect, so as to improve the wear resistance of the nitrided layer significantly.

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Section: The Microhardness and Wear Resistance Of The Nitrided Layersupporting

confidence: 89%

Section: The Microhardness and Wear Resistance Of The Nitrided Layermentioning

confidence: 80%

The Microstructure and Wear Resistance of the Ti-assisted Hot Plasma Nitrided Layer

Huang¹,

Ren²,

Lu³

et al. 2019

View full text Add to dashboard Cite

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“…Aluminum and its alloys are widely used in life and technique. Especially, the aluminum coated with an AlN layer can be used to improve LED performance [1,2], or it can be used as electronic packaging material [3,4]. In the optical industry, AlN can be used as protective coatings [5,6].…”

Section: Introductionmentioning

confidence: 99%

Nitrogen Trapping Ability of Hydrogen-Induced Vacancy and the Effect on the Formation of AlN in Aluminum

et al. 2017

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This paper presents the ternary interaction of N, H, and vacancy point defects and the nitrogen trapping ability of aluminum vacancies induced by hydrogen by means of DFT methods employed in VASP (Vienna Ab initio Simulation Package) and Abinit packages. The obtained vacancy formation energy of 0.65 eV is close to experimental values. Although the N-vacancy complex is unstable with the negative binding energy of −0.51 eV, the stability of H-vacancy-N is proved by the positive binding energy of 0.59 eV and the appearance of the orbital hybridization in the density of state (DOS) of atoms connecting to this complex. Moreover, Al vacancies can trap more than 4 N atoms, which prevents the formation of aluminum nitride and subsequently affects not only the hardness of the Al surface but also many practical applications of AlN coating.

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“…However, cost reduction is a continuous requirement for LED packages and LED manufacturers must reduce the cost of producing LED modules. Aluminum nitride (AlN) coatings are commonly used for heat dissipation in LEDs packaging devices because of their high optical transparency and their thermal and chemical stability [16][17][18][19][20][21][22]. Very few studies have reported the use of electrostatically sprayed AlN coatings as a thermal interface material.…”

Section: Introductionmentioning

confidence: 99%

“…Several recent studies have tried to improve the thermal conductivity of the base substrates by using alumina ceramic, AlN ceramic, silicon and Al metal PCB [8][9][10][11]. Several studies have reported noticeable improvements in the performance of LED s when ceramics with high thermal-conductivity are used to coat substrates [12][13][14][15]. However, cost reduction is a continuous requirement for LED packages and LED manufacturers must reduce the cost of producing LED modules.…”

Section: Introductionmentioning

confidence: 99%

Using AlN-Coated Heat Sink to Improve the Heat Dissipation of LED Packages

Jean

Jiang

et al. 2016

MATEC Web Conf.

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Abstract. This study optimizes aluminum nitride (AlN) ceramics, in order to enhance the thermal performance of light-emitting diode (LED) packages. AlN coatings are grown on copper/ aluminum substrates as a heat interface material, using an electrostatic spraying process. The effect of the deposition parameters on the coatings is determined. The thermal performance of AlN coated Cu/Al substrates is evaluated in terms of the heat dissipated and compared by measuring the LED case temperature. The structure and properties of the coating are also examined a scanning electron microscopy (SEM). In sum, the thermal performance of the LED is increased and good heat resistance characteristics are obtained. The results show that using AlN ceramic coating on a copper/aluminum substrate increases the thermal performance.

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Microstructural characterization and mechanical properties of nitrided layers on aluminum substrate prepared by nitrogen arc

Cited by 12 publications

References 23 publications

The Microstructure and Wear Resistance of the Ti-assisted Hot Plasma Nitrided Layer

The Microstructure and Wear Resistance of the Ti-assisted Hot Plasma Nitrided Layer

Nitrogen Trapping Ability of Hydrogen-Induced Vacancy and the Effect on the Formation of AlN in Aluminum

Using AlN-Coated Heat Sink to Improve the Heat Dissipation of LED Packages

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